An m2 solid state hard drive cooling sticker

Abstract

The invention discloses a heat dissipation sticker applied to a notebook computer, a desktop computer or an external M2 solid state hard disk. The heat dissipation sticker comprises: a thin porous foam metal copper layer, a two-way regular hexagonal array heat dissipation layer, a specially treated fixed copper sheet and a Silicone insulating pad. The present invention designs each structural size for the M2 solid state hard disk on the market, and realizes both light weight and efficient heat dissipation by utilizing the design of an efficient bidirectional regular hexagonal array heat dissipation layer and the like. The fixed copper sheet acts as a support and a reference plane. The silicone thermal insulation pad is connected to the user's M2 solid-state hard disk, which can not only play the role of bonding, buffering and electrostatic shielding, but also reduce the contact thermal resistance between the thermally conductive solid surfaces. The heat dissipation sticker of the invention is easy to install, and only needs the user to closely attach the heat dissipation sticker to the hard disk, so that the heat dissipation capacity of the hard disk can be greatly enhanced, the working temperature can be greatly reduced, and the compression and bending resistance of the user's M2 hard disk can be improved. Easy to install.

Description

technical field [0001] The invention relates to the technical field of computer components and mobile storage, in particular to a solid state hard disk with an M2 interface with a size of 22×80 mm. Background technique [0002] With the rapid development of information technology and the popularization of big data applications, people have put forward higher requirements for the storage capacity, storage speed, and integrity and flexibility of storage products. M2 solid state drive is a kind of memory that uses semiconductor chips as storage media, and it mainly includes two protocols: NVME and SATA. Since this type of solid state drive does not contain mechanical parts, its access speed is several times or even dozens of times higher than that of traditional mechanical hard drives. Solid-state drives have the advantages of fast read and write speed, low power consumption, small size, and wide working range. Currently, notebook computers are the most prominent personal comp...

AI Technical Summary

Problems solved by technology

However, if the existing technical solutions are applied to the heat dissipation of M2 solid-state drives, there are the following problems: From the perspective of the connection between the heat dissipation components and the implementation of the scheme, the above-mentioned mostly uses spot welding on the surface of the copper plate to complete the fixation, and the heat dissipation structure layer and the insulation layer cannot be realized. Effective insulation, and due to the narrow structure, it is difficult to process

In practical applications, for example, the space of the solid-state hard disk slot of a notebook computer is generally small, and a little carelessness may cause the above-mentioned metal-based copper-clad laminate heat dissipation structure to contact the motherboard or other components to cause a short circuit, causing irreparable losses to the computer; from the size On the other hand, its heat dissipation components are limited by the volume of the combined configuration structure, and it is difficult to make the thin and light size that meets the requirements of heat dissipation stickers. It is difficult to use on solid state drives and is not easy for users to install and carry. At the design level, the existing technology cannot effectively reduce the contact thermal resistance and thin the temperature boundary layer, or the degree of heat transfer enhancement is not obvious enough, and the heat transfer coefficient is small in a small space, etc., and the hexagonal heat dissipation structure is not adopted or used to a certain extent. Insufficient, so that the design of the above heat dissipation scheme cannot efficiently dissipate the heat generated by the M2 solid state drive when it is working

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