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Packaging product and production method thereof

A product and packaging area technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., which can solve problems such as increased processing costs and decreased profits

Inactive Publication Date: 2021-09-10
SHENZHEN JINCHUANGHONG PHOTOELECTRIC TECH CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the traditional packaging process of electronic components, it needs to be packaged after injection molding with compliant molds. Because of the specification requirements of electronic components, often a set of packaging molds can only be suitable for the packaging and processing of one type of electronic components. The height, length and width of packaged products are all fixed. To process packaged products of other specifications, it is necessary to replace the mold or improve the existing mold, which increases the processing cost and reduces the profit. Therefore, it is urgent A preparation method is needed to meet the packaging and processing requirements of electronic components of different specifications

Method used

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  • Packaging product and production method thereof
  • Packaging product and production method thereof

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preparation example Construction

[0023] refer to figure 1 , showing a flow chart of the steps of a method for preparing a packaged product, which is used to package electronic components arranged on the surface of a package substrate, the electronic components are provided with M, and M is an integer greater than or equal to 1, and the method includes the following step,

[0024] S1, using the first dispensing machine to enclose the fluid silicone along the side of the packaging substrate according to the first preset height to build a silicone fence with a packaging area on the inside, wherein M electronic components are located in the packaging area;

[0025] S2, after the silicone fence is cured, spread the fluid epoxy resin to a second preset height in the packaging area via a second glue dispenser, and the second preset height is less than or equal to the first preset height a preset height;

[0026] S3, curing the epoxy resin according to preset baking conditions to obtain the packaging product.

[0...

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Abstract

The invention relates to the technical field of packaging, and particularly relates to a packaging product and a production method thereof. The method comprises the steps: constructing a silica gel fence with a packaging region on the inner side along the side wall of a packaging substrate according to a first preset height by using fluid silica gel through a first dispensing machine, and enabling an electronic element to be located in the packaging region; after the silica gel fence is cured, flatly laying fluid epoxy resin to a second preset height in the packaging region through a second dispensing machine, wherein the second preset height is smaller than or equal to the first preset height; and baking and curing the epoxy resin according to the preset baking condition to obtain the packaged product so that the production cycle of the packaged product is shortened. The flowing range of the epoxy resin is limited through the silica gel fence, limitation of the epoxy resin on an external structure is reduced, the thickness of a packaged product can be controlled by the height of the silica gel fence, and regulation and control are convenient and fast.

Description

technical field [0001] The present application relates to the technical field of packaging, in particular to a packaging product and a preparation method thereof. Background technique [0002] In the traditional packaging process of electronic components, it needs to be packaged after injection molding with compliant molds. Because of the specification requirements of electronic components, often a set of packaging molds can only be suitable for the packaging and processing of one type of electronic components. The height, length and width of packaged products are all fixed. To process packaged products of other specifications, it is necessary to replace the mold or improve the existing mold, which increases the processing cost and reduces the profit. Therefore, it is urgent A preparation method is required to meet the packaging and processing requirements of electronic components of different specifications. Contents of the invention [0003] In view of the problems, the...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31H01L23/29
CPCH01L21/56H01L23/3107H01L23/293
Inventor 伍建国洪永斌
Owner SHENZHEN JINCHUANGHONG PHOTOELECTRIC TECH CO LTD
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