Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Quantum chip packaging equipment and packaging process thereof

A chip packaging, quantum technology, applied in transportation and packaging, semiconductor/solid-state device testing/measurement, conveyor objects, etc., can solve the problems of polluted workshop air, chip return processing and other problems

Pending Publication Date: 2021-09-10
赵琳
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the existing technology, the present invention provides a quantum chip packaging equipment, which has the advantages of real-time monitoring of chip packaging, air purification, etc., and solves the problems of chip returning to the factory for processing and polluting the air in the workshop

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Quantum chip packaging equipment and packaging process thereof
  • Quantum chip packaging equipment and packaging process thereof
  • Quantum chip packaging equipment and packaging process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0036] See Figure 1-7 One quantum chip package device includes a rail 1, and a cross frame 2 is fixedly provided in the rail 1 for supporting the bottom of the circuit board to be encapsulated, and the cross frame 2 comprises a vertical beam and a plurality of roots for forming a cross structure. The beam is fixed, and the leg 3 is fixed under the rail 2, and the leg 3 is fixed from the side of the rail 2, and the fixing plate 6 is fixed, and the fixing plate is fixed to the side of the rail 2, and there is a plurality of c...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of chip packaging, and discloses quantum chip packaging equipment and a packaging process thereof. The quantum chip packaging equipment comprises a sliding rail, wherein a cross-shaped frame is fixedly arranged in the sliding rail and used for supporting the bottom of a circuit board to be packaged, supporting legs are fixedly arranged below the sliding rail, a fixing plate is fixedly arranged on the face, away from the sliding rail, of each supporting leg, a plurality of ampere meters are fixedly arranged on the face, close to the sliding rail, of the fixing plate and used for detecting current, current transformers are fixedly arranged at the ends, close to the sliding rail, of the ampere meters and used for sensing current in the circuit board to be packaged, a fixing rod is fixedly arranged on one side of each current transformer, a plurality of electric push rods are fixedly arranged on the side, close to the current transformer, of the fixing rod, and a controller is fixedly arranged at one end of the fixing plate. According to the invention, the current transformer is used for detecting the states of the pins after welding each time, fault chips are picked out in time, the later detection energy is reduced, the production efficiency is improved, workshop air is purified through the exhaust pipe, and the working environment of workers is facilitated.

Description

Technical field [0001] The present invention relates to the field of chip packaging, in particular a quantum chip package apparatus and its packaging process. Background technique [0002] Quantum is an important concept of modern physics. That is, if there is a minimum inseparable basic unit, this physical quantity is quantized and the minimum unit is called quantum. The basic idea of ​​quantum communications is mainly proposed by Bennett equal to the 1980s and 1990s, mainly including quantum key distribution and quantum stealth transmission. The implementation of quantum communication is based on quantum-state transmission. In order to facilitate transmission, existing quantum communication experiments generally with photons as quantum state vectors, the expression is photon state transmission. The quantum information is mainly transmitted as light polarization, quantum communication application In many fields, especially in the processing of precision instruments, it is often ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/66H01L21/67H01L21/677
CPCH01L21/67253H01L24/78H01L24/85H01L22/14H01L22/20H01L21/67742H01L2224/789H01L2224/7865H01L2224/859
Inventor 赵琳武泽弟
Owner 赵琳
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com