Silicon carbide power module packaging structure capable of directly integrating phase change heat dissipation

A power module and packaging structure technology, which is applied in the direction of circuit heating devices, printed circuit components, electrical components, etc., can solve the problems of complicated module manufacturing process, increased energy consumption and cost of heat dissipation system, and increased complexity of heat dissipation system

Pending Publication Date: 2021-09-10
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although these heat dissipation methods can cope with the high heat flux density of silicon carbide chips, these more advanced methods increase the complexity of the heat dissipation system, reduce the reliability of the system, and also increase the energy consumption and cost of the heat dissipation system
[0006] 3. For the problem

Method used

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  • Silicon carbide power module packaging structure capable of directly integrating phase change heat dissipation
  • Silicon carbide power module packaging structure capable of directly integrating phase change heat dissipation
  • Silicon carbide power module packaging structure capable of directly integrating phase change heat dissipation

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Embodiment Construction

[0031] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only The embodiments are a part of the present invention, not all embodiments, and are not intended to limit the scope of the present invention. Also, in the following description, descriptions of well-known structures and techniques are omitted to avoid unnecessarily obscuring the concepts disclosed in the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0032] The schematic diagrams of the structures according to the disclosed embodiments of th...

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Abstract

The invention discloses a silicon carbide power module packaging structure capable of directly integrating phase change heat dissipation. The silicon carbide power module packaging structure comprises an upper bridge arm, a lower bridge arm, a bottom substrate, a shell, a power substrate, a driving PCB system and a phase change heat dissipation device, and is characterized in that the shell is buckled and fixed on the bottom substrate, the power substrate is fixed on the bottom substrate, the phase change heat dissipation device is fixed on the power substrate, and the upper bridge arm, the lower bridge arm and the driving PCB system are all fixed on the phase change heat dissipation device. According to the invention, the structure can greatly reduce the junction temperature and junction temperature fluctuation of a chip.

Description

technical field [0001] The invention belongs to the technical field of power device packaging, and relates to a silicon carbide power module packaging structure directly integrated with phase change heat dissipation. Background technique [0002] The power module is a module formed by packaging and integrating a series of power electronic power chips according to certain functions. Compared with the power electronic converter composed of discrete power electronic power devices, the power module has high reliability and high power density. , The characteristics of high integration, have high advantages in electrical performance, thermal performance, safety protection, cost and so on. Among the power modules, the half-bridge power module has flexible applications and can be constructed into various topologies such as MMC and three-phase inverters, and is the most widely used. [0003] In recent years, with the continuous development of power electronic devices, the requiremen...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/488H05K1/02
CPCH01L23/4275H01L23/488H05K1/0203
Inventor 王来利慕伟孙立杰张彤宇王彬宇杨奉涛
Owner XI AN JIAOTONG UNIV
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