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Heat pipe type printed circuit board heat exchanger

A technology for printed circuit boards and heat exchangers, which is applied in the field of micro-scale heat exchange and can solve problems that do not involve heat pipes and PCHEs.

Pending Publication Date: 2021-09-14
SHANGHAI MARITIME UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The system uses the symmetrical corrugated structure on both sides of the microchannel to enhance fluid turbulence and induce secondary flow, thereby enhancing heat transfer, but it does not involve the combination of heat pipes and PCHEs

Method used

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  • Heat pipe type printed circuit board heat exchanger
  • Heat pipe type printed circuit board heat exchanger
  • Heat pipe type printed circuit board heat exchanger

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Embodiment Construction

[0031] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0032] see Figure 1-5 , It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number and shape of components in actual implementation. and size drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual im...

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PUM

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Abstract

The invention discloses a heat pipe type printed circuit board heat exchanger. The heat pipe type printed circuit board heat exchanger comprises an upper cover plate, a lower cover plate, heat pipes, a plurality of heat exchange plate core bodies, a cold side inlet, a cold side outlet, a hot side inlet and a hot side outlet, wherein the upper cover plate is arranged on the upper parts of the heat exchange plate core bodies; the lower cover plate is arranged at the bottoms of the heat pipes; the heat pipes and the plurality of heat exchange plate core bodies are overlapped in a staggered mode and are welded; the cold side inlet is formed in one side of a first heat exchange plate core body; the cold side outlet is formed in the other side of the first heat exchange plate core body; the cold side inlet and the cold side outlet are oppositely formed; the hot side inlet is formed in one side of the second heat exchange plate core body; the hot side outlet is formed in the other side of the second heat exchange plate core body; and the hot side inlet and the hot side outlet are oppositely arranged. Through application of the embodiment, the printed circuit board heat exchanger is combined with the heat pipes, so that the heat pipes become media for heat exchange of cold and hot fluids; and the heat exchange efficiency is greatly improved.

Description

technical field [0001] The invention relates to the field of microscale heat exchange, in particular to a heat pipe type printed circuit board heat exchanger. Background technique [0002] With the comprehensive green transformation of my country's economic and social development, the demand for clean energy has promoted the rapid growth of liquefied natural gas (Liquid Nature Gas, LNG) consumption. The LNG intermediate fluid vaporizer (Intermediate Fluid Vaporizer, IFV), as a kind of LNG gasification equipment with wide application potential, is more and more favored by various countries. Printed Circuit Heat Exchanger (PCHE) is a new type of high-efficiency compact heat exchanger. Microchannels with a hydraulic diameter of mm are carved on the heat exchange plate by chemical etching technology, which greatly increases the heat exchange area of ​​the PCHE. , At the same time, several heat exchange plates are tightly connected by diffusion welding technology, which makes PC...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04H05K7/20
CPCF28D15/04H05K7/2039
Inventor 徐书铭田镇李坤黄志康
Owner SHANGHAI MARITIME UNIVERSITY
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