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Printed circuit board and packaging structure thereof

A technology of printed circuit board and packaging structure, which is applied in the direction of printed circuit grounding device, printed circuit, circuit device, etc., which can solve the problems of open circuit or decreased electrical conductivity, so as to avoid open circuit or decreased electrical conductivity, ensure grounding effect, and good The effect of electrical properties

Active Publication Date: 2021-09-17
SHENZHEN MINIEYE INNOVATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Based on this, it is necessary to provide a printed circuit board and its packaging structure for the problems of open circuit or reduced electrical conductivity.

Method used

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  • Printed circuit board and packaging structure thereof
  • Printed circuit board and packaging structure thereof
  • Printed circuit board and packaging structure thereof

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Embodiment Construction

[0025] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0026] Such as image 3 As shown, in one embodiment, a package structure of a printed circuit board is provided, including a circuit board body (not shown) and a via pad 100 provided with a connecting through hole 110, the circuit board body is provided with a mounting The through hole, ...

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Abstract

The invention relates to a printed circuit board and a packaging structure thereof. The packaging structure of the printed circuit board comprises a circuit board body and a via hole bonding pad provided with a connecting through hole, the circuit board body is provided with a mounting through hole, the via hole bonding pad is arranged in the mounting through hole, the via hole bonding pad is also provided with force unloading holes used for dispersing extrusion force, and the force unloading holes and the connecting through holes are arranged at intervals. When packaging is carried out, the via hole bonding pad is installed in the installation through hole of the circuit board body, and then the connecting piece is tightly matched with the connecting through hole, so that packaging of the printed circuit board is realized. In the fastening matching process of the connecting piece and the connecting through hole, along with the increase of the load, the extrusion force can be dispersed by utilizing the force unloading hole, so that the damage to electroless plating copper can be avoided, the problem of open circuit or conductivity reduction can be avoided, and meanwhile, the grounding effect can be ensured.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a printed circuit board and its packaging structure. Background technique [0002] As a very common electronic component, a printed circuit board (PCB, Printed Circuit Board) plays the role of a carrier for electrical connections of various electronic components. When in use, the traditional way is to package the printed circuit board on external structures such as housings by means of screw connection. In the process of encapsulating in the traditional way, the copper sinking in the middle is easy to be damaged, resulting in the problem of open circuit or decreased conductivity. Contents of the invention [0003] Based on this, it is necessary to provide a printed circuit board and its packaging structure to address the problems of open circuit or reduced electrical conductivity. [0004] Its technical scheme is as follows: [0005] On the one hand, a packagi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05F3/02
CPCH05K1/0215H05K1/0271H05K1/116H05F3/02
Inventor 赵艳刘国清辜民民王启程杨广
Owner SHENZHEN MINIEYE INNOVATION TECH CO LTD
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