Light device for efficient heat dissipation of cubic satellite electronic equipment

Abstract

The invention discloses a light device for efficient heat dissipation of cubic satellite electronic equipment, and belongs to the technical field of aerospace. The invention solves the problems that the existing cubic satellite electronic equipment is limited in heat dissipation area, too many parts are required by a heat transfer path, a thermal resistance is relatively large, the heat dissipation of high-power electronic equipment is not facilitated, and the cubic satellite is difficult to normally operate in an on-orbit business mode. A second heat conduction copper layer is clamped between the upper insulating material plate and the lower insulating material plate in parallel, the two third heat conduction copper layers are oppositely and fixedly installed at the two ends of the first heat conduction copper layer, sockets are installed on the top surface of the printed circuit board, and each socket is correspondingly connected with a pin header on the printed circuit board above the socket. Electrical connection between two adjacent printed circuit boards is realized, two ends of the plurality of printed circuit boards are correspondingly clamped in side surface grooves of the clamping groove type structure shells, and the top surface special-shaped end cover covers the top ends of the two clamping groove type structure shells.

Description

technical field [0001] The invention relates to a light device for efficient heat dissipation of cubic satellite electronic equipment, which belongs to the technical field of aerospace. Background technique [0002] Compared with traditional large-scale satellites, cube satellites have the characteristics of low development cost, short cycle and high power density. They can form constellations through rapid launch and networking, so as to realize the monitoring of ocean and atmospheric environment and be used for new technology test platforms, etc. aspect. In recent years, benefiting from the development of microelectronics, micromechanics, new materials and manufacturing technologies and their application on satellites, cube satellites with extremely low R&D costs, as a subversive innovation, are moving from demonstration to commercial application. [0003] As the functions of various electronic equipment in satellite application loads become more and more complex, and the...

AI Technical Summary

Problems solved by technology

The electronic components on the electronic module will generate a lot of heat when they work. If the heat cannot be dissipated in time, the components will be overheated and burned, so that the entire electronic equipment will fail or malfunction, which will affect the performance and life of the entire CubeSat. ; At the same time, the electronic equipment of each cube satellite needs to have a good fixing method on the star to deal with complex mechanical environments such as vibration and shock

[0004] Cube satellite electronic equipment in the prior art has a limited heat dissipation area, too many parts are required for the heat transfer path, and the thermal resistance is relatively large, which is not conducive to the heat dissipation of high-power electronic equipment, making it difficult for the satellite to operate normally in orbit; and, the existing The heat dissipation part of satellite electronic equipment has many mechanical parts, and the assembly steps are complicated, which is not conducive to the mass production of cube satellites

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