Flow equalizing cavity ring for wafer processing

Abstract

The invention relates to a flow equalizing cavity ring for wafer processing. The flow equalizing cavity ring comprises a ring body, a wafer is placed in an inner cavity of the ring body, a groove is formed in the end face of one end of the ring body, a first plate used for blocking the groove covers the end face of the ring body, an air inlet used for introducing external airflow into an inner cavity of the groove is formed in the outer wall of the first plate in a penetrating manner, a plurality of upper air outlet pipes used for increasing the air velocity on the surface of the wafer are arranged in the inner cavity of the groove and are circularly distributed around the axial direction of the ring body, one end of each upper air outlet pipe is located in the inner cavity of the groove, the other end of each upper air outlet pipe is located in the inner cavity of the ring body, a plurality of lower air outlet pipes used for increasing the flow speed of the bottom face of the wafer are arranged in the inner cavity of the groove, the upper air outlet pipes are circularly distributed in the axial direction of the ring body, one ends of the lower air outlet pipes are located in the inner cavity of the groove, the other ends of the lower air outlet pipes are located in the inner cavity of the ring body, and the wafer is located between the upper air outlet pipes and the lower air outlet pipes. The flow equalizing cavity ring has the effect of improving the wafer production quality.

Description

technical field [0001] The present application relates to the technical field of wafer processing, in particular to a flow sharing cavity ring for wafer processing. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. After the silicon crystal rod is ground, polished and sliced, it forms a silicon wafer, that is, a wafer. [0003] During the wafer manufacturing process, the wafer needs to be cooled several times. The general wafer cooling methods are divided into air cooling and artificial forced cooling. When air cooling, due to the high initial temperature of the wafer, natural cooling takes a lot of time. Therefore, it is necessary to accelerate the cooling of the wafer by means of an external cooling device. [0004] The existing cooling device on the market is usually a pipe with a nozzle, the nozzle is arranged perpendicular to the wafer, and the position of the nozzle is fixed during the cooling process. [000...

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Problems solved by technology

[0005] In view of the above-mentioned related technologies, the inventor believes that the nozzle is set directly on the wafer surface, and the air flow velocity at the position facing the wafer surface is high, while the air flow velocity between it and the wafer area is low, resulting in the cooling of each area of ​​the wafer. The speed is different, which will easily cause the deformation of the wafer, which seriously affects the production quality of the wafer.

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