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Integrated heat sink and air plenum for a heat-generating integrated circuit

A technology of integrated circuits and static pressure chambers, applied in the field of computer systems, can solve problems such as reducing the efficiency of heat exchangers, and achieve the effects of reducing fan power consumption, high processing speed, and reducing fan noise

Pending Publication Date: 2021-09-28
NVIDIA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These intermediate thermal resistances reduce the efficiency of the heat exchanger

Method used

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  • Integrated heat sink and air plenum for a heat-generating integrated circuit
  • Integrated heat sink and air plenum for a heat-generating integrated circuit
  • Integrated heat sink and air plenum for a heat-generating integrated circuit

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Embodiment Construction

[0040] In the following description, many specific details are set forth in order to provide a more thorough understanding of the various embodiments. However, it will be apparent to those skilled in the art that the concepts of the present invention can be practiced without one or more of these specific details.

[0041] Heat switch description

[0042] Figure 1A It is a perspective view of the heat exchanger 100 according to various embodiments of the present invention. Figure 1BIt is a side view of a heat exchanger according to various embodiments of the present invention 100. The heat exchanger 100 is a heat exchanger for an integrated circuit (IC) 101 and comprises an integrated heat spreader 120 and a low pressure drop static air pressure chamber (air plenum) 130, together with the heat exchanger 100 and IC 101 may be mounted on a printed circuit board (PCB) 104 on the electronic device. In an embodiment, the heat sink 120 thermally coupled to IC101 comprising one or more h...

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PUM

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Abstract

An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.

Description

[0001] Cross-reference [0002] The present application claims January 4, 2019, the sequence number 62 / 788, 659, the integrated heat sink and air static pressure chamber for fever integrated circuit (Integrated Heat Sink And Air Plenum for Aheat-generating integrated "Circuit" The priority interest in the US Provisional Patent Application, and requires the sequence number 16 / 555, 711, the title "for fever-feeding integrated circuits and air static pressure chambers on August 29, 2019. U.S. Patent Application for Integrated Heat Sink And Air Plenum for a Heat-GeneratingIntegrated Circuit. The subject matter of these related applications is hereby incorporated herein by reference. [0003] Inventive background Technical field [0004] Embodiments of the present invention generally relate to computer systems, more particularly, to integrated radiators and air static compartments for fever-generating integrated circuits (AIR PLENUM). Background technique [0005] In modern computing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20H01L23/427H01L23/473F28D15/02F28F1/32
CPCF28D15/0275F28F1/32F28F2215/04G06F1/20G06F2200/201H01L23/3672H01L23/427H01L23/467H05K7/20809H05K7/20336F28D2021/0029F28D1/0475F28F3/086H05K7/20F28D15/02
Inventor S·纳拉辛汉S·乔杜里
Owner NVIDIA CORP