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Amino polymerization inhibition modified heat-conducting particle and preparation method thereof

A thermally conductive particle and modified technology, applied in the field of additive manufacturing to reduce surface cracking

Active Publication Date: 2021-10-01
本时智能技术发展上海有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the technical problem to be solved by the present invention is: At present, the CLIP technology must continue to pass oxygen at the bottom of the resin tank and adopt an expensive gas-permeable Teflon film to construct a layer of untreated resin at the bottom of the liquid photosensitive resin. Solidify the liquid layer to achieve continuous light-cured 3D printing, which severely limits the popularization and application of CLIP technology

Method used

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  • Amino polymerization inhibition modified heat-conducting particle and preparation method thereof
  • Amino polymerization inhibition modified heat-conducting particle and preparation method thereof
  • Amino polymerization inhibition modified heat-conducting particle and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] The epoxy resin-based liquid photosensitive resin is 3D printed by using a PET light-transmitting release film, and the epoxy resin-based liquid photosensitive resin includes the following components in parts by weight:

[0056] 30 parts epoxy resin

[0057] Vinyl ether monomer 5 parts

[0058] Heterocyclic monomer 5 parts

[0059] Initiator 1 part

[0060] Pigment 0.1 part.

[0061] Amino polymerization-inhibited modified heat-conducting particles are added to the epoxy resin-based liquid photosensitive resin, and the mass concentration of the amino-inhibited polymerization-modified heat-conducted particles in the epoxy resin-based liquid photosensitive resin is 1%, and then the three-dimensional printing to be printed The CAD model of the object is sliced, and the thickness of the slice is 0.05mm. Finally, the printing platform is moved vertically upward at a speed of 200mm / h, and the 3D printed stereogram is obtained. figure 2 .

Embodiment 2

[0063] The epoxy resin-based liquid photosensitive resin is 3D printed by using a PET light-transmitting release film, and the epoxy resin-based liquid photosensitive resin includes the following components in parts by weight:

[0064] 50 parts of epoxy resin

[0065] Vinyl ether monomer 20 parts

[0066] Heterocyclic monomer 10 parts

[0067] Initiator 5 parts

[0068] 3 parts of paint.

[0069] Amino polymerization-inhibited modified heat-conducting particles are added to the epoxy resin-based liquid photosensitive resin, and the mass concentration of the amino-inhibited polymerization-modified heat-conducting particles in the epoxy resin-based liquid photosensitive resin is 1.5%, and then the three-dimensional printing to be printed The CAD model of the object is sliced, and the thickness of the slice is 0.025mm. Finally, the printing platform is moved vertically upward at a speed of 100mm / h, and the 3D printed stereogram is obtained. image 3 .

Embodiment 3

[0071] The epoxy resin-based liquid photosensitive resin is 3D printed by using FEP light-transmitting release film, and the epoxy resin-based liquid photosensitive resin includes the following components in parts by weight:

[0072] 40 parts epoxy resin

[0073] Vinyl ether monomer 10 parts

[0074] Heterocyclic monomer 8 parts

[0075] Initiator 3 parts

[0076] 1 part of paint.

[0077] Amino polymerization-inhibited modified heat-conducting particles are added to the epoxy resin-based liquid photosensitive resin, and the mass concentration of the amino-inhibited polymerization-modified heat-conducting particles in the epoxy resin-based liquid photosensitive resin is 1.5%, and then the three-dimensional printing to be printed The CAD model of the object is sliced, and the slice thickness is 0.1mm. Finally, the printing platform is moved vertically upwards at a speed of 300mm / h, and the 3D printed stereogram is obtained. Figure 4 .

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Abstract

The invention relates to the technical field of additive manufacturing, in particular to amino polymerization inhibition modified heat conduction particles and a preparation method thereof. At present, according to a CLIP technology, oxygen must be continuously introduced into the bottom of a resin tank, an uncured liquid layer can be constructed at the bottom of liquid photosensitive resin to achieve continuous photocuring 3D printing only by adopting an expensive breathable Teflon film, and application and popularization of the CLIP technology are seriously limited through the method. Based on the problems, the amino polymerization inhibition modified heat conduction particles are provided, after being added into the epoxy resin-based liquid photosensitive resin for CLIP printing, the amino polymerization inhibition modified heat conduction particles can settle in the epoxy resin-based liquid photosensitive resin, and finally a layer of blind area is formed at the bottom of the epoxy resin-based liquid photosensitive resin. the amino polymerization inhibition modified heat conduction particles in the blind area can neutralize protonic acid generated in the photopolymerization reaction of the epoxy resin-based liquid photosensitive resin, so that CLIP printing can be realized.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to an amino group inhibited polymerization modified heat-conducting particle and a preparation method thereof. Background technique [0002] 3D printing technology is a new type of processing and manufacturing technology in recent years. It has the advantages of high material utilization rate, can process any complex structure, and is easy to realize personalized customization. It has brought subversive influence on traditional processing and manufacturing industries. [0003] The surface forming 3D printing process is different from the traditional 3D printing process through point-by-point scanning and stacking processing. It can realize the overall forming of the two-dimensional layer of the part through sequential irradiation. It has the advantages of fast processing speed, high precision, and low cost. The principle of this technology is that under the control of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09C1/40C09C1/00C09C1/02C09C1/04C09C1/28C09C3/04C09C3/12C09C3/00C08K9/06C08K3/22C08K3/38C08K3/28C08K3/34C08F283/10C08F216/14B29C64/129B33Y10/00
CPCC09C1/407C09C1/40C09C1/028C09C1/043C09C1/28C09C1/00C09C3/12C09C3/043C09C3/006C09C3/003C08K9/06C08K3/22C08K3/38C08K3/28C08K3/34C08F283/10B29C64/129B33Y10/00C08K2003/2227C08K2003/222C08K2003/2296C08K2003/282C08K2003/385C08K2201/005C08F216/14
Inventor 路滕新殷瑞雪张楠
Owner 本时智能技术发展上海有限公司
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