Unlock instant, AI-driven research and patent intelligence for your innovation.

Capacitor

A technology of capacitors and electrodes, applied in the field of capacitors, can solve the problems of reducing the effective capacitance and influence of capacitors, and achieve the effect of reducing parasitic capacitance

Pending Publication Date: 2021-10-01
FARADAY TECH CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This parasitic capacitance affects (reduces) the effective capacitance of the capacitor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Capacitor
  • Capacitor
  • Capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0031] As used throughout this specification, including the claims, the term "coupled (or connected)" may refer to any means of connection, direct or indirect. For example, if it is described that a first device is coupled (or connected) to a second device, it should be interpreted that the first device can be directly connected to the second device, or the first device can be connected to the second device through other devices or certain A connection means indirectly connected to the second device. Terms such as "first" and "second" mentioned in the entire description of this case (including claims) are used to name components (elements), or to distinguish different embodiments or ranges...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a capacitor which includes a solid conductive plate, a first electrode, and a second electrode. The solid conductive plate is disposed above a substrate of a wafer. The solid conductive plate serves as a bottom plate of the capacitor. The first electrode is disposed above the solid conductive plate so that the solid conductive plate is located between the substrate and the first electrode. This first electrode serves as a top plate of the capacitor. The second electrode is disposed above the solid conductive plate, and is disposed beside the first electrode. The second electrode is electrically connected to the solid conductive plate.

Description

technical field [0001] The present invention relates to an integrated circuit, and more particularly to a capacitor. Background technique [0002] Capacitors are widely used in various integrated circuits. Capacitors can be implemented in various structures. For example, the capacitor structure may include interdigitated fingers to generate fringing capacitance. Generally, the capacitor structure is disposed above the substrate of the chip, and the substrate is grounded. An undesired parasitic capacitor exists between the top plate of the capacitor and the substrate. This parasitic capacitance affects (reduces) the effective capacitance of the capacitor. [0003] It should be noted that the content in the paragraph "Background Technology" is used to help the understanding of the present invention. Some (or all) of the content disclosed in the "Background" paragraph may not be known to those skilled in the art. The content disclosed in the "Background Technology" paragr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L49/02H01L23/552H10N97/00
CPCH01L28/60H01L23/552H01L28/86H01G4/012H01G4/228H01G4/33
Inventor 田佳辉林童泽洪志源吕志勋
Owner FARADAY TECH CORP