Chip testing method and device

Abstract

The embodiment of the invention discloses a chip testing method and device, which relate to the technical field of semiconductor processing, and can effectively improve the yield of crystal grains. The method comprises the following steps of according to a preset rule, selecting at least one part of invalid crystal grains obtained by a mass production test to obtain alternative crystal grains, carrying out an additional test on the alternative crystal grains, wherein the test condition of the additional test is different from the test condition of the mass production test, and in response to the alternative crystal grain passing the additional test, appointing an application scene corresponding to a test condition of the additional test for the alternative crystal grain to obtain a target crystal grain. The method is suitable for chip testing.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a chip testing method and device. Background technique [0002] In the semiconductor manufacturing process, since the process conditions in the reaction chamber are not exactly the same (for example, the process conditions at the edge of the wafer and the center of the wafer are different), the specific process parameters of different dies (die) on the same wafer There are also differences, resulting in certain deviations in the performance of each grain, and even some grains may not be able to achieve their expected functions, resulting in grain failure. [0003] Grain failure can generally be divided into two types: hard failure (hard fail) and soft failure (soft fail). Among them, hard failure is mainly reflected in the short circuit or open circuit of semiconductor devices or metal interconnection layers in the grain due to process defects, and the complete ...

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Problems solved by technology

[0004] In related technologies, when testing the die on the wafer, no matter wheth

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