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Circuit board

A circuit board and dielectric constant technology, applied in the direction of circuit substrate materials, printed circuits, printed circuits, etc., can solve the problems of circuit board reliability degradation, increase in the overall thickness of the circuit board, and decrease in insulator strength, so as to reduce transmission loss, The effect of satisfying strength and improving reliability

Pending Publication Date: 2021-10-08
LG INNOTEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, there is a problem that the overall thickness of the board increases
[0010] In addition, when an insulator with a low dielectric constant is used, the strength of the insulator decreases, so there is a problem that the reliability of the circuit board deteriorates

Method used

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  • Circuit board
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Embodiment Construction

[0026] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the spirit and scope of the present invention are not limited to a part of the described embodiments, and may be implemented in various other forms, and within the spirit and scope of the present invention, one or more of the embodiments may be selectively combined and replaced. elements.

[0027] In addition, unless otherwise clearly defined and described, the terms (including technical terms and scientific terms) used in the embodiments of the present invention can be interpreted as having the same meanings as commonly understood by those of ordinary skill in the art to which the present invention belongs, and such as in Terms defined in commonly used dictionaries may be construed to have meanings consistent with their meanings in the context of the related art.

[0028] In addition, terms used in the embodiments of the present invention...

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Abstract

A circuit board, according to an embodiment, comprises a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.

Description

technical field [0001] The invention relates to a circuit board. Background technique [0002] A printed circuit board (PCB) is formed by printing a circuit wiring pattern with a conductive material such as copper on an electrically insulating substrate, and thus a PCB refers to a board immediately before electronic components are mounted thereon. That is, in order to densely mount various types of electronic components on a flat surface, a PCB refers to a circuit board having a flat surface on which the mounting position of each component is fixed, and a circuit pattern connecting the components is Fixedly printed on this flat surface. [0003] Generally, as a surface treatment method for a circuit pattern included in the above-mentioned PCB, an organic solderability preservative (OSP: organic solderability preservative) method, an electrolytic nickel / gold method, an electrolytic nickel / gold-cobalt alloy method, an electroless nickel / palladium / Gold method etc. [0004] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/03H05K1/02
CPCH05K1/0237H05K1/036H05K1/0366H05K2201/09481H05K2201/0347H05K2201/0338H05K1/181H05K3/323H05K3/3436H05K3/284H05K3/282H05K1/0243H05K3/4682H05K1/0306H05K1/0298
Inventor 崔炳均黄玟泳任贤九
Owner LG INNOTEK CO LTD