Unlock instant, AI-driven research and patent intelligence for your innovation.

Silicon wafer transfer device

A technology for handover device and silicon wafer, which is applied in the direction of photolithography process exposure device, transportation and packaging, instruments, etc., can solve the problems of damage to silicon wafer, unstable adsorption of silicon wafer, increase anti-interference of silicon wafer, etc., to improve reliability. to ensure the effect of anti-interference

Active Publication Date: 2021-10-12
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a silicon chip handover device to solve the potential safety hazards of unstable silicon chip adsorption and damage to silicon chips in the prior art when silicon chips are handed over, to ensure that all chip joint hands can absorb silicon chips, and increase Anti-interference during silicon wafer transmission, improving product reliability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon wafer transfer device
  • Silicon wafer transfer device
  • Silicon wafer transfer device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Such as figure 1 As shown, the present embodiment provides a silicon wafer transfer device, including a splicing device and a driving part 2, and the driving part 2 is used to drive the splicing device to approach the silicon wafer and absorb the silicon wafer. The splicing device includes a splicing plate 3, a flexible mechanism 4 and a splicing hand 5, the splicing plate 3 is in transmission connection with the driver 2, the flexible mechanism 4 is arranged on the splicing plate 3, and a plurality of splicing hands 5 are installed on the flexible mechanism 4 And it is spaced apart from the splicing plate 3. When the splicing hand 5 is subjected to a downward force, the flexible mechanism 4 deforms vertically, and the splicing hand 5 can move vertically downward to ensure that all the splicing hands 5 can absorb Silicon wafers, increase the anti-interference performance during the silicon wafer transmission process, and improve the reliability of the silicon wafer tran...

Embodiment 2

[0083] The difference between this embodiment and Embodiment 1 is that: Figure 9 As shown, in the silicon wafer handover device provided in this embodiment, the interface connected to the air hose 7 on the manifold block 6 is located below the splice plate 3. Therefore, in this embodiment, the air hose 7 is located at the interface. Below the plate 3.

[0084] In addition, the guide rail 92 is cylindrical, and is slidably sleeved on the guide rail 92 at the assembling part of the connecting plate 3 to ensure that the connecting plate 3 can rise and fall stably in the vertical direction.

[0085] Such as Figure 10-Figure 11 As shown, the flexible mechanism 4 of the present embodiment includes elastic pieces 421 and connecting blocks 422, elastic pieces 421 are arranged on the upper and lower sides of the connecting plate 3, and the free ends of the elastic pieces 421 protrude to the outside of the connecting plate 3; 422 is arranged at intervals with the connecting plate 3,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of photoetching equipment, and discloses a silicon wafer transfer device which comprises a wafer receiving device and a driving part, and the driving part is used for driving the wafer receiving device to approach a silicon wafer to adsorb the silicon wafer; the wafer receiving device comprises a splicing plate, a flexible mechanism and splicing hands, the splicing plate is in transmission connection with the driving part, the flexible mechanism is arranged on the splicing plate, the splicing hands are installed on the flexible mechanism, the splicing hands and the splicing plate are arranged at intervals, and when the splicing hands are subjected to downward acting force, the flexible mechanism deforms in the vertical direction, and the splicing hands can move downwards in the vertical direction. If a dip angle exists between the plane where the adsorption ends of the plurality of wafer receiving hands are located and the silicon wafer, the wafer receiving hand which is firstly in contact with the silicon wafer is subjected to vertical downward acting force from the silicon wafer, the wafer receiving hand moves downwards, and the wafer receiving plate continues to lift the other wafer receiving hands to move upwards until all the wafer receiving hands are in contact with the silicon wafer and adsorb the silicon wafer; and therefore, the anti-interference performance in the silicon wafer transmission process can be ensured, and the reliability of the silicon wafer transfer device is improved.

Description

technical field [0001] The invention relates to the technical field of photolithography equipment, in particular to a silicon wafer transfer device. Background technique [0002] In the semiconductor lithography process, a silicon wafer transfer device is used to transfer the silicon wafer to the silicon wafer carrier in the lithography equipment, and then complete a series of exposure actions to transfer the image to the silicon wafer. The three splicing hands in the existing silicon wafer transfer device are directly installed on the splicing plate of the rigid structure, and the three suction heads at the top of the splicing hands are in the same horizontal plane. During the silicon wafer handover process, the silicon wafer handover device is installed on the workbench. The workbench includes a bottom frame, a coarse movement module and a fine movement module. There will be errors (such as uneven installation foundation of the workbench, deformation of the bottom frame, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/677H01L21/683G03F7/20
CPCH01L21/67742H01L21/6838G03F7/70716Y02P70/50
Inventor 张雯
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD