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Ceramic shell, ceramic packaging structure and micro-system

A ceramic shell and ceramic packaging technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of low packaging integration, few types of components, and unsatisfactory miniaturization and high integration, and meet heat dissipation requirements. Enhanced cooling channels and miniaturization

Pending Publication Date: 2021-10-19
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, traditional ceramic shells can be installed with few types of components, and the packaging integration level is low, which does not meet the requirements of miniaturization and high integration level.
Moreover, traditional ceramic housings cannot meet the requirements of hermetic packaging of bonded chips and high-power flip-chip heat dissipation at the same time.

Method used

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  • Ceramic shell, ceramic packaging structure and micro-system
  • Ceramic shell, ceramic packaging structure and micro-system
  • Ceramic shell, ceramic packaging structure and micro-system

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Embodiment Construction

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, and are not intended to limit the present invention.

[0021] Such as Figure 1 to Figure 4 As shown, the embodiment of the present invention discloses a ceramic shell, which includes a ceramic shell 1 , and the ceramic shell 1 has a first surface 2 and a second surface 3 oppositely arranged. In actual use, the second surface 3 is a side facing the PCB, and the first surface 2 is a side away from the PCB. When the PCB board is placed horizontally and the device made of the ceramic housing is installed above the PCB board, the first surface 2 is the upper surface of the ceramic housing 1 , and the seco...

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Abstract

The invention provides a ceramic shell, a ceramic packaging structure and a micro-system. The ceramic shell comprises a ceramic shell body, the ceramic shell body is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an airtight packaging area and a non-airtight packaging area, the non-airtight packaging area is provided with a circular flip bonding pad, and the second surface is provided with an airtight packaging area and a lead. The airtight packaging area is formed by a kovar metal welding ring in an enclosing manner, a chip mounting area and / or a component mounting area are / is arranged in the airtight packaging area, and the chip mounting area is of a multi-layer cavity structure used for mounting bonding chips. According to the ceramic shell, various devices and chips can be installed on the first surface and the second surface, the air tightness requirement of a common bonding chip can be guaranteed through the airtight packaging area, a flip chip can be installed in the non-airtight packaging area, the heat dissipation requirement of a high-power flip chip can be met, and miniaturization and high integration level can be achieved.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and more specifically relates to a ceramic shell, a ceramic packaging structure and a microsystem. Background technique [0002] With the continuous improvement of micro-system integration, the number of packaging cores, power consumption and chip packaging requirements are becoming more and more diverse. become a prominent issue. At present, traditional ceramic housings have few types of components that can be installed, and the packaging integration level is low, which does not meet the requirements of miniaturization and high integration level. Moreover, traditional ceramic housings cannot meet the requirements of hermetic packaging of bonded chips and heat dissipation of high-power flip-chips at the same time. Contents of the invention [0003] An object of the present invention is to provide a ceramic case capable of achieving airtightness and good heat dissipation p...

Claims

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Application Information

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IPC IPC(8): H01L23/04H01L23/10H01L23/367H01L25/16
CPCH01L23/04H01L23/10H01L23/367H01L25/16
Inventor 刘洋杨振涛彭博高岭段强
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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