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Sputtering equipment and operation method thereof

An operation method and sputtering technology, which can be used in sputtering, ion implantation, vacuum evaporation, etc., can solve the problems of time-consuming, waste of materials, and easy occurrence of defects in sputtering.

Active Publication Date: 2021-10-22
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the method of sputtering only a single substrate 10 at one time is quite time-consuming.
In addition, since the required line position is only between the upper and lower pads 16, the in-plane area of ​​the liquid crystal panel does not need plating, resulting in material waste
In addition, the sputtering of the target towards the main surface 12 will cause the plating to be next to the pad 16 and close to the side 14 (such as Figure 1A The area in the dotted line box) is prone to defects

Method used

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  • Sputtering equipment and operation method thereof
  • Sputtering equipment and operation method thereof
  • Sputtering equipment and operation method thereof

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Embodiment Construction

[0081] In the drawings, the thickness of the layer, membrane, panel, region, and the like is enlarged for clarity. In the entire specification, the same reference numerals denote the same elements. It should be understood that when the elements such as layers, membranes, regions, or substrates are referred to as they are connected to another element, they can be directly connected to another element or with another element, or the intermediate element can also exist. In contrast, there is no intermediate element when the element is called directly on another element or directly connected to another element. As used herein, the connection can refer to physical and or electrically connected. Furthermore, the electrical connection or coupling line can be other components between the binary parts.

[0082] figure 2 It is a schematic diagram of a sputtering apparatus according to an embodiment of the present invention. image 3 Yes figure 2 Splashing equipment topic view. See figure 2 ...

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Abstract

The invention provides sputtering equipment and an operation method thereof. The sputtering equipment is suitable for sputtering a plurality of substrates, each substrate comprises two opposite main surfaces and a plurality of side surfaces connected with the two main surfaces, and the sputtering equipment comprises a cavity, at least one target material group and a bearing box. The at least one target material group is arranged in the cavity, each target material group comprises a plurality of target materials, and the target materials in each group are arranged on the two sides of an axis in a staggered mode. The bearing box is movably arranged to enter and exit the cavity and comprises a plurality of substrate containing grooves, the substrates are suitable for being placed in the substrate containing grooves of the bearing box, each substrate is suitable for extending out of the bearing box, at least one of the side surfaces is located outside the bearing box, and at least one side surface extending out of the bearing box faces at least one target material group.

Description

Technical field [0001] The present invention relates to a sputtering apparatus and a method of operation, and more particularly to a sputtering apparatus suitable for sputtering a plurality of substrates and its operational methods. Background technique [0002] Figure 1A It is a schematic diagram of a substrate sputtering in a known manner. Referring to FIG. 1, in general, the liquid crystal panel (substrate 10) has two main surface 12 and a plurality of side surfaces 14 connecting two main surfaces 12. A plurality of pads 16 are provided in a portion adjacent the side surface 14 (that is, an area other than the in-plane region) (eg, Figure 1A There are two upper and lower pads 16 near the right side. At present, the upper and lower pads 16 are mainly electrically connected to each other by sputtering the substrate 10. [0003] The existing sputtering procedure is to place a single sheet substrate 10 into a sputter (not shown), and the target (not shown) is located above the ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/50
CPCC23C14/3464C23C14/50H01J37/3435C23C14/3407C23C14/505
Inventor 侯君岳庄皓安
Owner AU OPTRONICS CORP