Lossless storage device for silicon wafers for manufacture of communication electronic products

Abstract

The invention provides a lossless storage device for silicon wafers for manufacture of communication electronic products, and relates to the field of communication electronic materials. The lossless storage device for the silicon wafers for manufacture of the communication electronic products comprises U-shaped storage racks, a shell, bearing plates and connecting pieces, wherein the interior of the shell is of a hollow structure, and a sealing cover is buckled to an access opening in the top of the shell; the bearing plates are symmetrically installed at the front end and the rear end of the interior of the shell, and the inner sides of the two bearing plates are connected together through supporting rods; the connecting pieces are symmetrically installed at the front end and the rear end in the shell, and are connected with the bearing plates; the U-shaped storage racks are installed in the shell in an array mode; and U-shaped cotton grooves are formed in the U-shaped storage racks, and the silicon wafers are slidably inserted into the U-shaped cotton grooves. According to the lossless storage device for the silicon wafers for manufacture of the communication electronic products provided by the invention, when the front side and the rear side of the shell are impacted by external force, the U-shaped storage racks slide back and forth in the shell, so that the impact force is counteracted; and the U-shaped storage racks automatically slide and reset through magnetic force according to the principle that like poles of magnets repel, so that the storage effect of the silicon wafers in the U-shaped storage racks is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of communication electronic materials, and more specifically relates to a non-destructive storage device for silicon wafers used in the manufacture of communication electronic products. Background technique [0002] Silicon wafers, also known as wafers, are processed from silicon ingots. Millions of transistors can be etched on silicon wafers through special processes. They are widely used in the manufacture of communication and electronic products. Because silicon wafers are easy to Because of its crushing characteristics, special storage devices are usually required for storage and transportation. [0003] The storage device for silicon wafers used in the manufacture of communication electronic products can refer to patent CN210025214U, which mainly includes a top plate and a bottom plate; a sliding plate, the top and bottom of the sliding plate slide between the opposite sides of the top plate and the bot...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a non-destructive storage device for silicon wafers used in the manufacture of communication electronic products to solve the problem that the existing similar silicon wafer storage devices used in the manufacture of communication electronic products have poor protection effect on silicon wafers. When the outside is hit by an external force, it is very easy to cause the internal silicon chip to be broken due to excessive force, and the storage device is easily stored upside down due to human negligence, causing the silicon chip inside the device to roll out and be damaged, affecting the use effect of the silicon chip

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