A press-fitting device for a semiconductor device and a pressure detection method thereof

Abstract

The invention provides a press-fitting device of a conductor device and a pressure detection method thereof. The upper positioning part of the press-fitting device is provided with an upper pressing plate force application part and an upper pressing plate limiting part, which are arranged in a staggered manner along the circumference of the upper positioning part; the lower positioning part is provided with a lower pressing plate force applying part and a lower pressing plate limiting part, and the lower pressing plate limiting The position part is arranged on the outer periphery of the force application part of the lower platen, and the force force part of the upper platen and the force force part of the lower platen respectively abut against the upper platen and the area where the adjustment assembly is arranged on the upper platen. The detection method includes setting a pressure detection piece in the semiconductor device; determining the actual effective pressure value of the semiconductor device; determining the pressure value of the press; repeating the above steps, changing the pressure value of the press, and measuring the actual effective pressure value corresponding to the pressure value of the different press and Press the pressure value of the press to obtain a linear relationship; obtain the actual effective pressure value of the semiconductor device. The invention has the advantages of ensuring effective press-fitting of semiconductor devices, accurate detection of actual effective pressure values, and convenient operation.

Description

A press-fitting device for a semiconductor device and a pressure detection method thereof technical field The present invention relates to the field of power electronic semiconductor device pressing, in particular to a pressing device for semiconductor devices and its pressure detection method. Background technique At present, the pressing device of the existing semiconductor device usually consists of an upper pressing plate, a lower pressing plate, a tightening screw and other elastic Support accessories, etc. When the crimping force required for the semiconductor device is small (such as below 80kN), the crimping device uses a torque wrench Tightening the bolts with a certain torque can complete the press-fitting of semiconductor devices; however, as the crimping force required for semiconductor devices increases Large (such as more than 100kN), the required crimping force cannot be achieved by using a torque wrench. The large pressing force will force the uppe...

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Problems solved by technology

When the crimping force required by the semiconductor device is small (such as below 80kN), the press-fitting device can complete the crimping of the semiconductor device by tightening the bolt with a torque wrench with a certain torque; but as the crimping force required for the semiconductor device increases ( Such as more than 100kN), the torque wrench is often unable to achieve the required crimping force. At this time, a press is required, and usually a large press-fitting force will force the upper and lower pressure plates to deform after the external pressure is released, making the semiconductor device The actual pressure attenuation does not meet the application requirements of the device. At this time, the internal components of the semiconductor device cannot be reliably contacted, which directly affects the performance of the semiconductor device.

[0003] At the same time, semiconductor devices such as high-power thyristors are usually affected by external factors such as external vibrations, switch shocks, temperature changes, and failure of butterfly springs during the process of press-fitting and putting into use, resulting in a gradual decrease in the effective press-fitting force of semiconductor devices. , when the effective press-fitting force is reduced beyond the required pressure range, it will inevitably affect the performance of the device, cause damage to the device, and cause problems such as failure to work.

However, when a semiconductor device fails, the residual pressure of the semiconductor device will often disappear with the dismantling of the device, and the residual pressure result calculated by the disassembly torque is often due to the change of external factors such as the friction coefficient, resulting in the calculated The result deviates a lot from the actual residual pressure, and it is impossible to obtain accurate actual residual pressure of the semiconductor device, and it is also impossible to judge whether the effective press-fitting force is within the required pressure range, so it is impossible to guarantee the best performance of the semiconductor device.

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