High-miniaturization L-waveband 900W GaN power amplification module
A power amplifier module and L-band technology, applied in the field of highly miniaturized L-band 900W GaN power amplifier module, can solve the problems of size reduction, power only 500W, complex structure, etc., to reduce insertion loss, increase isolation, The effect of size reduction
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[0032] Example: such as Figure 1-11 As shown, a highly miniaturized L-band 900W GaN power amplifier module of the present invention includes a GaN power tube 1, and one side of the GaN power tube 1 is sequentially provided with a first leakage voltage 2, an output interface 3 and a second leakage voltage 4 , the other side of the GaN power transistor 1 is provided with a first grid voltage 5, an input interface 6, and a second grid voltage 7 in sequence, and the size of the GaN power transistor 1 is 46.8mm×38.5mm×7.4mm, and the GaN power There is a chip die inside the tube 1, and the chip die is a 300W GaN power chip. The internal impedance value of the chip chip needs to match the input and output to a pure 50, and the internal power of the GaN power tube 1 is 900W. According to S(6, 6) is the matching coefficient of 300 power chips, and S(10, 10) is the matching coefficient of 40W. worse stability;
[0033] Under the same power, the narrower the bandwidth of the frequency...
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