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Rigid epoxy glue solution

A technology of epoxy glue and rigidity, applied in the field of epoxy glue, can solve the problems of low rigidity, limited use conditions and use occasions of two-component epoxy glue, achieve high rigidity, increase tensile and compressive strength Effect

Pending Publication Date: 2021-11-05
杭州固安科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing epoxy glues are divided into one-component epoxy glue and two-component epoxy glue; among them, the one-component epoxy glue has good heat resistance and good elastic film-forming property. The characteristics of the two-component epoxy glue are widely used, and the two-component epoxy glue has the characteristics of low-temperature rapid curing and high storage stability; both have high application prospects, but the rigidity of the two-component epoxy glue is low. The use conditions and use occasions are limited, and there are many inconveniences when used in a specific environment. Therefore, the present invention relates to a rigid epoxy glue, which is mainly suitable for strengthening and bonding steel ring sleeves

Method used

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  • Rigid epoxy glue solution
  • Rigid epoxy glue solution

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Effect test

Embodiment 1

[0019] A kind of rigid epoxy glue solution, comprising the first component and the second component that the volume ratio is 3:1; In parts by mass, the first component includes 70 parts of bisphenol A type epoxy resin with an epoxy value of 0.49, 30 parts of phenolic modified epoxy resin, 10 parts of phenyl glycidyl ether, 2 parts of γ-glycidyl ether propyl trimethoxysilane; in parts by mass, component B includes 30 parts of alicyclic amine modified curing agent , 10 parts of phenolic modified cyclopentylamine curing agent, 1.12 parts of tertiary amine accelerator.

[0020] A kind of preparation method of rigid epoxy glue:

[0021] S1. Preparation of component A: Pour the substances of component A into the stirring and dispersing tank in turn according to the mass ratio, stir, and set aside;

[0022] S2. Preparation of component B: Stir each component of component B in a closed container and set aside;

[0023] S3. Preparation of epoxy glue: mix component A and component B b...

Embodiment 2

[0025] A kind of rigid epoxy glue solution, comprising volume ratio is A component and B component of 3:1; In parts by mass, A component comprises 50 parts of bisphenol A type epoxy resins with an epoxy value of 0.51, 30 parts of phenolic modified epoxy resin, 20 parts of phenyl glycidyl ether, 2 parts of γ-aminopropyltriethoxysilane; in parts by mass, component B includes 30 parts of alicyclic amine modified curing agent, 15 parts of phenolic modified cyclopentylamine curing agent, 1.02 parts of tertiary amine accelerator.

[0026] A kind of preparation method of rigid epoxy glue:

[0027] S1. Preparation of component A: Pour the substances of component A into the stirring and dispersing tank in turn according to the mass ratio, stir, and set aside;

[0028] S2. Preparation of component B: Stir each component of component B in a closed container and set aside;

[0029] S3. Preparation of epoxy glue: mix component A and component B before use, and stir evenly to prepare rigi...

Embodiment 3

[0031] A kind of rigid epoxy glue solution, comprising volume ratio is 3:1 component A and component B; In parts by mass, component A includes 80 parts of bisphenol A type epoxy resin with an epoxy value of 0.52, 40 parts of phenolic modified epoxy resin, 18 parts of phenyl glycidyl ether, 1 part of γ-aminopropyltriethoxysilane, 1 part of γ-diethylenetriaminopropylmethyldimethoxysilane; In terms of parts, component B includes 30 parts of alicyclic amine modified curing agent, 10 parts of phenolic modified cyclopentylamine curing agent, and 1.4 parts of tertiary amine accelerator.

[0032] A kind of preparation method of rigid epoxy glue:

[0033] S1. Preparation of component A: Pour the substances of component A into the stirring and dispersing tank in turn according to the mass ratio, stir, and set aside;

[0034] S2. Preparation of component B: Stir each component of component B in a closed container and set aside;

[0035] S3. Preparation of epoxy glue: mix component A an...

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Abstract

The invention provides a rigid epoxy glue solution. The rigid epoxy glue solution comprises a component A and a component B in a volume ratio of (2-4): 1, the component A comprises the following components in parts by mass: 50-80 parts of bisphenol A epoxy resin, 20-40 parts of phenolic aldehyde modified epoxy resin, 10-20 parts of a diluent with polyfunctional groups and 1-2 parts of a silane coupling agent; and the component B comprises the following components in parts by mass: 25-70 parts of a modified curing agent and 0.5-1.5 parts of a tertiary amine accelerant. The invention relates to a rigid epoxy glue solution which is a double-component epoxy glue solution, bisphenol A type epoxy resin and phenolic aldehyde modified epoxy resin are added into a component A, meanwhile, a modified curing agent is added into a component B, and after the double components are mixed, each active group achieves a high-density hinge. Therefore, the cured product has high rigidity performance.

Description

technical field [0001] The invention relates to a rigid epoxy glue solution, which belongs to the technical field of epoxy glue. Background technique [0002] With the vigorous development of aviation, aerospace, rail transit and construction and other fields, the construction requirements of a large number of rail transit and other public facilities have gradually increased. Among them, the platforms of subway trains and other public facilities are equipped with guardrails to strengthen the stability of the guardrails and For firmness, it is usually necessary to use colloid to strengthen and bond the steel ring sleeve on the guardrail. Most of the existing epoxy glues are divided into one-component epoxy glue and two-component epoxy glue; among them, the one-component epoxy glue has good heat resistance and good elastic film-forming property. The characteristics of the two-component epoxy glue are widely used, and the two-component epoxy glue has the characteristics of low...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/04C09J11/00C09J11/06C08G59/50
CPCC09J163/00C09J11/00C09J11/06C08G59/5026C08G2170/00C08L63/04C08K5/5435C08K5/544C08K5/5425
Inventor 赖永安赖克爱
Owner 杭州固安科技有限公司