Array fin type condensing device and loop heat pipe

Abstract

The invention belongs to the technical field of thermal control, and discloses an array fin type condensing device and a loop heat pipe comprising the condensing device. A body of the condensing device is a cylinder, an upper partition plate and a lower partition plate are arranged in the body and divide the interior of the body into a steam cavity, a heat exchange cavity and a condensate cavity, and a steam inlet is formed in the upper portion of the body; a condensate outlet is formed in the lower portion of the body, the steam inlet communicates with the steam cavity, the condensate outlet communicates with the condensate cavity, a plurality of hollow columnar fins arranged in an array mode are arranged in the heat exchange cavity, the top ends and the bottom ends of the hollow columnar fins are open, and through holes are formed in the positions, connected with the hollow columnar fins, of the upper partition plate and the lower partition plate; and the interiors of the hollow columnar fins serve as steam micro-channels for steam circulation. According to the condensing device, the fins with the micro-channels are adopted, the primary heat exchange area is increased, the condensing efficiency of the condenser is improved, and miniaturization of the condenser under certain condensing efficiency is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of heat control, and in particular relates to an array fin type condensation device and a loop heat pipe. Background technique [0002] Heat pipe is a high-efficiency phase change heat transfer element developed in the 1970s. It consists of three parts: evaporation section, adiabatic section and condensation section. It has the advantages of no need for additional energy, no moving parts, and small heat transfer temperature difference. It ingeniously combines the two phase-change heat processes of boiling and condensation, and can quickly and evenly transfer the heat accumulated on the surface of electronic components to the device with a larger heat dissipation area through the evaporation of the working medium of the heat pipe under the condition of small temperature difference. On the condensing surface, it can solve the problem that the current high heat flux electronic components are difficult to dissip...

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Problems solved by technology

[0005] The loop heat pipe has many advantages such as large heat transfer distance, strong heat dissipation capacity, strong anti-gravity, good heat balance, convenient installation and layout, etc., but the traditional loop heat pipe still has defects: the cooling of the condenser adopts external air cooling or liquid cooling There is a large contact thermal resistance between the cooler and the condenser, and the fin efficiency of the cooler is low, which cannot meet the increasing heat dissipation demand under the limited heat dissipation area; on the other hand, the capillary core of the evaporator has air The accumulation phenomenon is easy to cause the system to fail to start, and the traditional capillary core structure is difficult to balance the contradiction between the high capillary pump suction and high permeability on the pore size requirements

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