Laminated packaging structure for mounting multiple circuit boards

Abstract

The invention discloses a laminated packaging structure for mounting multiple circuit boards, and belongs to the field of printed circuit boards. The laminated packaging structure for mounting the multiple circuit boards comprises a mounting plate, a plurality of uniformly distributed printed circuit board bodies are arranged on the mounting plate, two pairs of buffer frame plates are connected between every two adjacent printed circuit board bodies. Each buffer frame plate comprises L-shaped frame plates, a buffer strip is connected between the pair of L-shaped frame plates, and a supporting plate matched with the buffer strip is connected to the L-shaped frame plates in a sliding mode. The bottom end of the printed circuit board body is fixedly connected with the supporting plates, and a plurality of guide pipes matched with the buffer strip are fixedly connected to the L-shaped frame plates. A series connection frame comprises a plurality of segment columns. An arc-shaped frame is connected between the two segment columns at the top end. Therefore, a plurality of circuit boards can be mounted in a laminated manner, the occupied space of the circuit boards on a plane is reduced, the circuit boards can be effectively and comprehensively protected after the circuit boards are mounted in the laminated manner, and meanwhile, the heat dissipation of the circuit boards is facilitated.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a stacked package structure for mounting multiple circuit boards. Background technique [0002] With the rapid development of wireless communication, automotive electronics and other consumer electronics, microelectronic packaging technology is developing in the direction of multi-function, miniaturization, portability, high speed, low power consumption and high reliability. Among them, system-in-package is a new type of packaging technology, which can effectively reduce the packaging area. [0003] Existing printed circuit boards, with the high integration of smart devices, the power is getting bigger and bigger, and the heat dissipation of the circuit board has become a problem that must be considered in the packaging process, especially for complex smart devices that tend to be in a small space Install multiple circuit boards, the heat generated by the circuit board itse...

AI Technical Summary

Problems solved by technology

[0003] Existing printed circuit boards, with the high integration of smart devices, the power is getting bigger and bigger, and the heat dissipation of the circuit board has become a problem that must be considered in the packaging process, especially for complex smart devices that tend to be in a small space Install multiple circuit boards, the heat generated by the circuit board itself, except for a small part of the heat dissipated through the bottom carrier board and solder joints, the main heat is through natural heat dissipation, but if multiple circuit boards are installed densely, the circuit boards will interact with each other Influence, and the thermal conductivity of the sealed package structure is usually poor, therefore, the temperature around the chip is too high and the work efficiency of the chip is affected

[0004] The current multi-circuit board packaging structure cannot effectively ensure the heat dissipation effect of the circuit board and is not easy to protect multiple circuit boards that are densely installed. When the mounting structure is damaged by the outside world, the circuit board is also easily damaged

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