Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip test substrate and chip test system

A chip testing and substrate technology, applied in the field of chip testing substrates and chip testing systems, can solve the problems of large probe loss, poor contact, affecting testing efficiency, etc., and achieve the effects of improving testing efficiency, avoiding loss and reducing costs

Pending Publication Date: 2021-11-19
苏州乐芯科技有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the dense distribution of pins on the chip, it is difficult for ordinary testers to stick the probes. It is easy to pin the probes crookedly, inaccurately, or even cause poor contact accidents, which affects the test efficiency and affects the probe. The loss is also large, which increases the cost of chip testing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip test substrate and chip test system
  • Chip test substrate and chip test system
  • Chip test substrate and chip test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are given in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to understand the disclosure content of this application more thoroughly and comprehensively.

[0025] In this application, terms such as "installation", "connection", "connection" and "fixation" should be interpreted in a broad sense, for example, it can be a fixed connection or a detachable connection, unless otherwise clearly specified and limited. , or integrated; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal commu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of chips, and particularly discloses a chip test substrate and a chip test system. The substrate comprises a circuit board, a wiring terminal and a decoupling capacitor, the circuit board comprises a plurality of bonding pads, and the plurality of bonding pads are used for connecting a plurality of pins of a chip; the wiring terminal is connected with the circuit board and comprises a first end and a second end, the first end is connected with the bonding pads, and the second end is used for being connected with a chip test device; the decoupling capacitor is connected between the second end and the ground end. Therefore, a probe does not need to be used for leading out a chip pin, only the chip pin needs to be connected to the preset bonding pad on the circuit board, and the bonding pad is connected with the wiring terminal, so that during actual testing, the wiring terminal is connected with the chip test device, and electric connection between the chip test device and the chip pin can be realized; therefore, the difficulty of connecting the chip before testing is effectively reduced, the testing efficiency is improved, the loss of the probe is avoided, and the chip testing cost is reduced.

Description

technical field [0001] The present application relates to the field of chip technology, in particular to a chip testing substrate and a chip testing system. Background technique [0002] Before the chip is put into use, a series of tests are often required. The usual method is to lead out the pins of the chip through the probe station, and then connect the test equipment to the outside, and test the chip through the test equipment. However, due to the dense distribution of pins on the chip, it is difficult for ordinary testers to stick the probes. It is easy to pin the probes crookedly, inaccurately, or even cause poor contact accidents, which affects the test efficiency and affects the probe. The loss is also large, which increases the cost of chip testing. Contents of the invention [0003] Based on this, it is necessary to provide a chip testing substrate and a chip testing system to address the above problems. [0004] A kind of chip test substrate, described chip te...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R31/28
CPCG01R31/2863G01R31/2884
Inventor 张明云
Owner 苏州乐芯科技有限公司