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Circulating cooling embedded packaging substrate and manufacturing method thereof

A technology of packaging substrates and cyclic cooling, which is used in semiconductor/solid-state device manufacturing, electrical components, and electrical solid-state devices, etc., and can solve problems such as reduced reliability of electronic products, reduced operating speed of electronic components, and increased loss.

Pending Publication Date: 2021-11-19
ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONICS SUBSTRATE SOLUTIONS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As we all know, as the temperature of the operating environment rises, the operating speed of electronic components decreases, and the loss increases. At the same time, the reliability of electronic products is relatively reduced when they are operated in a high temperature environment for a long time.

Method used

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  • Circulating cooling embedded packaging substrate and manufacturing method thereof
  • Circulating cooling embedded packaging substrate and manufacturing method thereof
  • Circulating cooling embedded packaging substrate and manufacturing method thereof

Examples

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Embodiment 1

[0077] Please refer to figure 1 , this embodiment discloses a circulating cooling embedded packaging substrate, including a dielectric material body 010 , a chip 120 , a first metal surface 310 , a second metal surface 320 and a first wiring 210 . The dielectric material body 010 is provided with an encapsulation cavity 101 (please refer to Figure 7 or Figure 8 ), the chip 120 is packaged in the package cavity 101, the chip 120 has a heat dissipation surface 121 and an active surface 122, the active surface 122 of the chip 120 is provided with several terminals for exchanging signals with the outside, and the first metal surface 310 is provided In the dielectric material body 010, the first metal surface 310 covers and is connected to the heat dissipation surface 121 of the chip 120, the second metal surface 320 is arranged on the surface of the first metal surface 310, and the second metal surface 320 is provided with a cooling channel 322. The first cooling channel figur...

Embodiment 2

[0086] Please refer to Figure 5 , the embodiment of the present invention discloses a circulating cooling embedded packaging substrate, including a dielectric material body 010, a chip 120, a first metal surface 310, a heat-conducting metal surface 160, a second metal surface 320, and a first wiring 210, and the dielectric material The body 010 is provided with a package cavity 101, the chip 120 has a heat dissipation surface 121 and an active surface 122, and the active surface 122 of the chip 120 is provided with several terminals for exchanging signals with the outside, and the chip 120 is packaged in the package cavity 101, The first metal surface 310 is embedded in the dielectric material body 010 and covers the heat dissipation surface 121 of the chip 120. The heat conduction metal surface 160 is connected between the first metal surface 310 and the heat dissipation surface 121 of the chip 120. The heat conduction metal surface 160 The area is less than or equal to the ...

Embodiment 3

[0091] The embodiment of the present invention discloses a method for manufacturing a circulating cooling embedded packaging substrate, which includes steps S310-S360. The steps of the manufacturing method of the circulating cooling embedded packaging substrate of this embodiment are described in detail below:

[0092] S310, please refer to Figure 7 , providing a support frame 100 used as a first dielectric layer 110, the support frame 100 is provided with an encapsulation cavity 101, and has opposite first and second surfaces, wherein the support frame 100 is made of a polymer material, and the polymer material It can be FR4, Ajinomoto buildup material, polyimide, prepreg with glass cloth or a combination thereof. It should be understood that the number of encapsulation cavities 101 may be one or more. For ease of description, this embodiment takes one encapsulation cavity 101 as an example for illustration.

[0093] S320, please refer to Figure 8 , providing a temporary...

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Abstract

The invention discloses a circulating cooling embedded packaging substrate and a manufacturing method thereof. The circulating cooling embedded packaging substrate comprises a dielectric material body, a chip, a first metal surface, a second metal surface and a first wire, wherein the dielectric material body is provided with a packaging cavity, the chip is packaged in the packaging cavity, the first metal surface is embedded in the dielectric material body, the first metal surface covers and is connected with the heat dissipation surface of the chip, the second metal surface is embedded in the dielectric material body and connected to the surface of the first metal surface, the second metal surface is provided with a first cooling channel pattern used for forming a cooling channel, the first wire is arranged on the surface of the dielectric material body or embedded in the dielectric material body, and the first wire is connected with a corresponding terminal on the active surface of the chip through a first conductive structure. According to the invention, the first metal surface and the second metal surface are arranged on the heat dissipation surface of the chip, a cooling channel can be formed, the heat dissipation performance is improved, the cooling channel can be formed in the machining process of the packaging substrate, the machining steps are simple, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a circulating cooling embedded packaging substrate and a manufacturing method thereof. Background technique [0002] With the development and progress of electronic technology, electronic products are evolving in the direction of short, light and thin, and the functional requirements of electronic products are becoming more and more powerful, which promotes the development of packaging structures of electronic products in the direction of high integration and miniaturization. At the same time, the application of electronic components is also developing in the direction of high frequency, high speed, and high power, resulting in a rapid increase in heat flux per unit area. [0003] As we all know, as the temperature of the operating environment rises, the operating speed of electronic components decreases and the loss increases. At the same time, the reliability of...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/373H01L23/46H01L21/48
CPCH01L23/3736H01L23/367H01L23/46H01L21/4882H01L2224/73267H01L2224/04105H01L2224/32245H01L24/19H01L23/5389H01L23/473H01L23/49822H01L21/4857H01L21/4878H01L23/13H01L23/3677H01L23/49827H01L23/49838H01L21/52H01L21/486
Inventor 陈先明洪业杰黄本霞冯磊
Owner ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONICS SUBSTRATE SOLUTIONS TECH