Micro-strip plate and substrate welding device and using method

Abstract

The invention discloses a micro-strip plate and substrate welding device and a using method. Each micro-strip plate comprises a welding surface and a mounting surface opposite to the welding surface, the welding surfaces are used for welding the substrates, and the mounting surfaces are used for mounting components. The micro-strip plate and substrate welding device comprises a plurality of welding pieces, a welding tool and welding equipment; each welding piece is arranged between the corresponding substrate and the welding surface of the corresponding micro-strip plate, and each welding piece, the corresponding substrate and the corresponding micro-strip plate form a to-be-welded assembly; the welding tool is used for bearing each to-be-welded assembly and flattening the micro-strip plate in each to-be-welded assembly; and the welding equipment is used for containing the welding tool and melting the welding piece in each to-be-welded assembly on the welding tool, so that the corresponding substrates and the micro-strip plates are bonded. According to the micro-strip plate and substrate welding device, welding of the micro-strip plate and the substrate can be realized, and the welding quality and the welding efficiency can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of microstrip board manufacturing, in particular to a microstrip board and substrate welding device and a use method. Background technique [0002] Microstrip plate and substrate brazing refers to a process that uses low-temperature solder to remelt and wet and diffuse on the welding surface of the microstrip plate and substrate to form an electrical and mechanical metallurgical combination. The welded microstrip plate has the characteristics of good grounding ability, thermal conductivity, low void rate and high penetration rate; the microstrip plate with higher penetration rate can significantly reduce the voltage standing wave ratio in high-frequency circuits and reduce Insertion loss, improve microwave signal transmission efficiency. [0003] The above welding technology has been widely used in aviation, aerospace, radar, military equipment and other fields. However, with the development of science and...

AI Technical Summary

Problems solved by technology

However, with the development of science and technology, the signal frequency band used for microwave-based circuits is getting higher and higher, and the output scale is also getting larger and larger. When using traditional reflow soldering or artificial hot platform soldering technology for batch soldering of microstrip boards and substrates, It has been unable to meet the increasingly higher requirements of microwave circuits on welding quality (including void rate, penetration rate, thermal conductivity, etc.) and welding efficiency.

At present, the main reasons for restricting batch automatic welding of microstrip boards and substrates are as follows: 1. The positioning accuracy between microstrip boards and substrates is high, and the positioning accuracy is ≤±0.05mm; 2. The thickness of microstrip boards is relatively high. Thin (generally 0.254mm), high requirements on the press tooling; 3. The welding process needs to be uniform and continuous pressure on the microstrip board and the substrate to ensure that the microstrip board after welding will not warp due to thermal expansion Qu; 4. Welding void rate is difficult to solve by conventional equipment and conventional process methods

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