Semiconductor refrigeration ion wind air conditioning system
A technology of air-conditioning system and refrigeration system, which is applied in the direction of air-conditioning system, noise suppression, space heating and ventilation, etc. It can solve the problems of uneconomical and practical, poor refrigeration effect, etc., and achieve ingenious and reasonable structural design, high-efficiency and energy-saving refrigeration effect , small size effect
Pending Publication Date: 2021-11-30
GUANGDONG UNIV OF TECH
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Problems solved by technology
[0005] The purpose of the present invention is to overcome the problems that the existing semiconductor refrigeration air-conditioning system used in confined spaces has poor cooling effect and is not economical and practical, and provides a semiconductor refrigeration ion wind air conditioning system
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Embodiment 1
[0041] like Figures 1 to 7 As shown, a semiconductor refrigeration ion air conditioning system includes:
[0042] Refrigeration system: includes a circulating airway 1, opened on the circulating airway 1 and is provided in the engaged air passage 11 and the exhaust passage 12 for connecting the application environment, and is disposed in the circulating air duct 1, the first semiconductor assembly 2 and the second semiconductor The assembly 3, and the ion wind generating device provided in the circulating airway 1 to form a flow airflow, the cold end of the first semiconductor assembly 2 and the second semiconductor assembly 3 is in the circulating airway 1 in communication with the application environment;
[0043] The heat radiating system connected to the first semiconductor assembly 2 and the second semiconductor assembly 3, the heat end of the first semiconductor assembly 2, and the second semiconductor assembly 3 close to the heat dissipation system and through the heat diss...
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The invention provides a semiconductor refrigeration ion wind air conditioning system which comprises a refrigeration system and a heat dissipation system. The refrigeration system comprises a circulating air duct, an air-inlet channel, an air exhaust channel, a first semiconductor assembly, a second semiconductor assembly and an ion wind generating device, wherein the air-inlet channel and the air exhaust channel are formed in the circulating air duct and used for communicating with an application environment, the first semiconductor assembly and the second semiconductor assembly are arranged in the circulating air duct, the ion wind generating device is arranged in the circulating air duct and used for forming flowing airflow, the heat dissipation system is connected with the first semiconductor assembly and the second semiconductor assembly and located outside the circulating air duct, and the hot ends of the first semiconductor assembly and the second semiconductor assembly are tightly attached to the heat dissipation system and conduct heat exchange with the external environment through the heat dissipation system. According to the system, the problems that a conventional semiconductor refrigeration ion wind air conditioning system is poor in refrigeration effect and not economical and practical are solved, the two-stage efficient refrigeration performance is achieved while the basic functions of silent air supply and air purification are achieved, and the ion wind generating device is ingenious in design, small in size and low in energy consumption.
Description
Technical field [0001] The present invention relates to the field of semiconductor refrigeration technology, and more particularly to a semiconductor cooling ion air conditioning system. Background technique [0002] In some cases where the refrigeration is required, the use of semiconductor refrigeration can serve well, when a piece of N-type semiconductor material and a thermocouple of a p-type semiconductor material are connected in the middle of the current, both ends The heat transfer is generated, and the heat will be transferred from one end to the other end, thereby generating temperature differences to form a hot feet, connect the cold end of the semiconductor material to the application environment, and connect the hot end of the semiconductor material to the outside environment, pass through A current is applied to the semiconductor material, and heat dissipation is performed on both ends of the heat and heat to ensure temperature difference between the heat and heat, ...
Claims
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IPC IPC(8): F24F5/00F24F8/192F24F8/26F24F8/30F24F13/24F24F13/30
CPCF24F5/0042F24F13/30F24F8/192F24F8/30F24F8/26F24F13/24
Inventor 王长宏蔡坚锋罗思一曾志颢
Owner GUANGDONG UNIV OF TECH