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Single-layer capacitor and preparation method thereof

A capacitor and single-layer technology, applied in the field of capacitors, can solve the problems of small electrode area and low capacitance of layer capacitors, and achieve the effect of improving capacitance, dielectric constant and obvious effect.

Active Publication Date: 2021-11-30
原粒威(深圳)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The object of the present invention is to provide a single-layer capacitor and its preparation method, which solves the problem of small electrode area and low capacitance of the layer capacitor, and improves the grain boundary layer at the same time. The formation quality of the grain boundary layer of the capacitor further improves the device performance

Method used

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  • Single-layer capacitor and preparation method thereof
  • Single-layer capacitor and preparation method thereof
  • Single-layer capacitor and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as Figure 1-2 , as shown in 4:

[0038] The single-layer capacitor includes a ceramic dielectric layer 1 and a metal protection layer 4; the edge of the ceramic dielectric layer 1 extends outside the metal protection layer 4, and the epitaxial part forms a support body 5; the upper surface of the ceramic dielectric layer 5 and An upper electrode 3 - 1 and a lower electrode 3 - 2 are arranged on the lower surface, and the two cooperate to form a channel structure; an electroplated copper layer 2 is provided between the channel structure and the metal protection layer 4 .

[0039] The side of the channel structure forms an arrayed trapezoidal section, and the angle range of the base angle A of the trapezoid is 80°C.

[0040] The preparation process includes the following steps:

[0041] S1: Place the ceramic slurry in a DLP light-curing 3D printer, adopt the interval exposure-layer printing technology, set the thickness of each layer of layer printing to 5 μm, and t...

Embodiment 2

[0046] Such as Figure 1-2 As shown: the single-layer capacitor includes a ceramic dielectric layer 1 and a metal protection layer 4; the edge of the ceramic dielectric layer 1 extends outside the metal protection layer 4, and the epitaxial part forms a support body 5; the ceramic dielectric layer 5 An upper electrode 3-1 and a lower electrode 3-2 are arranged on the upper surface and the lower surface respectively, and the two cooperate to form a channel structure; an electroplated copper layer 2 is provided between the channel structure and the metal protection layer 4 .

[0047] The side of the channel structure forms an arrayed trapezoidal section, and the angle range of the base angle A of the trapezoid is 65°C.

[0048] The preparation process includes the following steps:

[0049] S1: Place the ceramic slurry in a DLP light-curing 3D printer, adopt the interval exposure-layer printing technology, set the thickness of each layer of layer printing to 2 μm, the exposure l...

Embodiment 3

[0054] Such as Figure 1-2 As shown: the single-layer capacitor includes a ceramic dielectric layer 1 and a metal protection layer 4; the edge of the ceramic dielectric layer 1 extends outside the metal protection layer 4, and the epitaxial part forms a support body 5; the ceramic dielectric layer 5 An upper electrode 3-1 and a lower electrode 3-2 are arranged on the upper surface and the lower surface respectively, and the two cooperate to form a channel structure; an electroplated copper layer 2 is provided between the channel structure and the metal protection layer 4 .

[0055] The side of the channel structure forms an arrayed trapezoidal section, and the angle range of the bottom angle A of the trapezoid is 85°C.

[0056] The preparation process includes the following steps:

[0057] S1: Place the ceramic slurry in a DLP light-curing 3D printer, adopt the interval exposure-layer printing technology, set the thickness of each layer of layer printing to 10 μm, the exposur...

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Abstract

The invention discloses a single-layer capacitor and a preparation method thereof. The single-layer capacitor comprises a ceramic dielectric layer and a metal protection layer, the edge of the ceramic dielectric layer extends out of the metal protection layer, and the extension part forms a support body; the upper surface and the lower surface of the ceramic dielectric layer are respectively provided with an upper electrode and a lower electrode which are matched with each other to form a channel structure; and an electroplating copper layer is arranged between the channel structure and the metal protection layer. According to the single-layer capacitor and the preparation method thereof, the ceramic dielectric layer of the channel structure is formed through 3D printing, the area of the lower electrode and the thickness of the ceramic dielectric are reduce under the condition of same size, the capacitance of the capacitor is increased by 10-100 times, and the dielectric constant is increased; and through an indirect exposure-layer-by-layer printing technology, the distribution uniformity of ceramic grains is improved, a fine grain state and the shrinkage of a grain boundary layer are realized, and the dielectric constant is further increased.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a single-layer capacitor and a preparation method thereof. Background technique [0002] With the development of energy storage capacitors and other related equipment in the direction of light weight, miniaturization, high insulation and high energy storage density in recent years, the energy storage dielectric needs to have a higher dielectric constant, lower dielectric loss and higher Strong pressure resistance. [0003] Single-layer capacitors, especially grain boundary layer capacitors, are popular due to their excellent performance at high frequency operation. Compared with ordinary ceramic capacitors, grain boundary layer capacitors have a higher dielectric constant, and the apparent dielectric constant E of a once-fired capacitor is app It can reach more than 40,000. However, due to the need for semiconducting and oxidation processes during the preparation of the gra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12H01G4/005
CPCH01G4/12H01G4/005Y02E60/13
Inventor 黎兆早余恺为吴明洋
Owner 原粒威(深圳)科技有限公司
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