Guide module, PCBA and mounting method

Abstract

The invention discloses a guide module, a PCBA and a mounting method. The guide module comprises a connecting assembly which is used for being fixedly connected with a first hole site of a PCB and locking the PCB and a case, the connecting assembly does not exceed a top surface of the PCB, and the guide module further comprises a guide piece which is used for being fixedly connected with a second hole site of the PCB and used for mounting and guiding components on the top surface of the PCB. According to the guide module, the PCB and the case are connected through the connecting assembly under the condition that the space of the PCB is narrow, so that the requirement for stability of connection of the PCB and the case can be met, and meanwhile, the connecting assembly does not exceed the top surface of the PCB; in addition, due to the arrangement of the guiding piece, the guiding function can be achieved when the electronic component on the top face of the PCB is installed, and the electronic component on the top face of the PCB can be fixedly installed. Therefore, the DFM barrier-free secondary tin brushing and automatic surface mounting technology can be met, and the PCBA production welding quality and the production efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of servers, in particular to a guide module, a PCBA and a placement method. Background technique [0002] At present, the PCBA welding technology is to solder the front and back of the PCB twice through the furnace. PCB (Print circuit Board) refers to the printed circuit board without soldered components, usually refers to the light board; Printed circuit board assembly with components. Usually, the side with fewer parts and lower height of the PCB is tinned first (this side is called the bottom side), and the side with more parts and higher device height is put on the second tin (this side is called the bottom side). top surface), which can prevent taller and larger components from falling due to gravity during the second pass of the furnace, so the concept of brushing tin in the second pass of the furnace is produced. [0003] In the prior art, a guide PIN structure 4 is usually provided under the condit...

AI Technical Summary

Problems solved by technology

However, the guide PIN structure 4 after soldering will have a PIN angle 5 protruding from the top surface 3, so that when the top surface 3 is soldered for the second time, the brush knife will be covered by the entire protruding guide PIN structure during the tin brushing process. 4 Blocking, the tin brushing program cannot be continued. The current solution is to manually solder the device, which will cause a large amount of manual work during the mass production of the board, which is time-consuming, laborious, inefficient, and will also lead to poor quality of manual soldering

[0004] Therefore, it is a technical problem that those skilled in the art need to solve at present how to avoid the PIN angle protruding from the top surface of the guiding PIN structure soldered on the PCB, which will affect the tin brushing on the top surface.

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