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Polishing carrier capable of measuring thickness on line

A technology of polishing carrier and thickness measurement, which is applied in working carrier, grinding/polishing equipment, and parts of grinding machine tools, etc., can solve the problem of inability to real-time feedback system polishing removal amount and polishing thickness, etc., so as to improve polishing Efficiency and polishing yield, waste savings, improved assembly and serviceability effects

Active Publication Date: 2021-12-07
ZHEJIANG JINGSHENG MECHANICAL & ELECTRICAL +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a polishing carrier capable of online thickness measurement, which solves the technical problem that the current polishing removal amount and the thickness of the throwing sheet cannot be fed back in real time in the prior art; and achieves the technical effect of being able to feed back the thickness of the throwing sheet in real time

Method used

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  • Polishing carrier capable of measuring thickness on line
  • Polishing carrier capable of measuring thickness on line
  • Polishing carrier capable of measuring thickness on line

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Embodiment Construction

[0039] The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", The orientation or positional relationship indicated by "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description , rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and th...

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Abstract

The invention relates to the technical field of wafer processing, in particular to a polishing carrier capable of measuring the thickness online, which comprises a carrier body used for bearing a polished piece; a thickness measuring assembly comprising a detection channel, the detection channel is arranged in the carrier body, and the detection channel penetrates to one end, bonded with the polished piece, of the carrier body; and a detector which is fixedly connected to the carrier body and is used for sending a detection signal to the polished piece through the detection channel so as to detect the thickness of the polished piece and outputting the thickness of the polished piece. The polishing carrier capable of measuring the thickness on line provided by the invention has the advantages that the technical problem that in the prior art, the current polishing removal amount and the polished piece thickness of the system polished piece cannot be fed back in real time is solved; and the technical effect of feeding back the polished piece thickness in real time is achieved.

Description

technical field [0001] The invention relates to the technical field of wafer processing, in particular to a polishing carrier capable of online thickness measurement. Background technique [0002] Polishing plays an important role in the semiconductor processing technology. Polishing can realize the mirror surface of the throwing plate, and can also improve the flatness of the throwing plate; it can remove the damage caused by the previous process step to the surface of the throwing plate to a certain extent. [0003] In the prior art, the air-pressurized polishing carrier used in the polishing equipment can only provide the function of pressurizing and absorbing the throwing plate, and cannot detect the actual polishing state of the throwing plate online, that is, it is impossible to feed back the current state of the throwing plate to the system in real time. Polishing removal and disc thickness. [0004] Therefore, the technical problem of the prior art is that the polis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B49/00B24B37/30B24B41/06B24B7/22
CPCB24B37/005B24B49/00B24B37/30B24B41/068B24B7/228
Inventor 朱亮沈文杰潘兴兴黄金涛谢龙辉郑猛陈莹
Owner ZHEJIANG JINGSHENG MECHANICAL & ELECTRICAL
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