Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate integrated waveguide transmission line with improved single-mode bandwidth

A technology of substrate integrated waveguide and transmission line, which is applied in the direction of waveguide, waveguide-type devices, circuits, etc., to achieve the effect of improving single-mode transmission bandwidth

Inactive Publication Date: 2021-12-07
SHANGHAI JIAO TONG UNIV
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It is difficult for the above technologies to significantly increase the single-mode transmission bandwidth while reducing the lateral size. Significantly improve single-mode transmission bandwidth while having a small lateral size

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate integrated waveguide transmission line with improved single-mode bandwidth
  • Substrate integrated waveguide transmission line with improved single-mode bandwidth
  • Substrate integrated waveguide transmission line with improved single-mode bandwidth

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]The first dielectric substrate 1 is made of Taconic TLY material with a dielectric constant of 2.2 and a dielectric loss tangent of 0.001. The second dielectric substrate 6 is made of Taconic CER-10 material with a dielectric constant of 10.0 and a dielectric loss tangent of 0.0035. The width w of the first metal patch 2 = 8mm, the width w of the second metal patch 5 s = 1.2 mm. Width w of the third metal patch 7 g =6.5mm, the thickness h of the first dielectric substrate 1 1 =0.5mm, the thickness h of the second dielectric substrate 6 2 =1.5mm, air hole diameter d a = 0.8mm, the period of air through holes p = 0.8mm. Different dielectric substrate thickness ratio h 2 / h 1 The effect of the change on the cut-off frequency of the dominant mode (mode 1) and higher order mode (mode 2) is as follows image 3 As shown, the influence of the variation of the dielectric constant of the underlying substrate on the cut-off frequency of the main mode (mode 1) and the higher...

Embodiment 2

[0044] In this embodiment 2, except that the width w of the first metal patch 2 is set to 8mm, the width w of the third metal patch 7 g Except that it is set to 8mm, the setting parameters of other components are the same as those in Embodiment 1.

Embodiment 3

[0046] In this embodiment 2, except that the width w of the first metal patch 2 is set to 9.5 mm, the width w of the third metal patch 7 g Except that it is set to 8mm, the setting parameters of other components are the same as those in Embodiment 1.

[0047] To sum up, the present invention adopts a ridge half-mode substrate integrated waveguide transmission structure filled with two layers of dielectric substrates with different dielectric constants and an air via hole array, and uses metal ridges to introduce coupling capacitance. Under the condition of constant working cut-off frequency, A reduction in the lateral size of the waveguide is achieved. And by filling two layers of dielectric substrates with different dielectric constants and loading air via arrays, the single-mode transmission bandwidth has been significantly improved. Although the integrated waveguide on the ridge half-mode substrate increases the processing complexity, it reduces the lateral size and achiev...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a substrate integrated waveguide transmission line with improved single-mode bandwidth. The waveguide transmission line comprises a first dielectric substrate, a first metal patch, a first metal via hole, a second metal via hole, a second metal patch, a second dielectric substrate and a third metal patch. The first dielectric substrate, the first metal patch, the first metal via hole, the second metal via hole and the second metal patch form a metal ridge filled with different materials, an air via hole array is arranged in the first dielectric substrate, and then a ridge half-mode substrate integrated waveguide and air via hole array mixed transmission structure is formed. Compared with a traditional substrate integrated waveguide, the transverse size is reduced, and meanwhile the single-mode transmission bandwidth is improved, and in addition, the hybrid structure is simple and compact, easy to integrate, convenient to manufacture and wide in application range, and has a wide application prospect in an ultra-wideband communication system.

Description

technical field [0001] The invention relates to the technical field of waveguide transmission devices, in particular to a substrate-integrated waveguide transmission line with improved single-mode bandwidth. Background technique [0002] Substrate integrated waveguide (SIW) has the advantages of good shielding, low cost, high quality factor, high power capacity, and easy integration, and has become an important choice for microwave and millimeter wave circuit devices and high-speed electrical interconnection systems. Compared with transmission lines such as microstrip lines and coplanar waveguides, the main disadvantages of substrate-integrated waveguide technology are larger lateral dimensions and limited single-mode transmission bandwidth (SMB). [0003] In order to reduce the lateral size of the substrate-integrated waveguide and increase its single-mode transmission bandwidth, related studies have proposed various substrate-integrated waveguides such as substrate-integra...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01P3/18
CPCH01P3/18
Inventor 李晓春纪磊朱宏彬毛军发
Owner SHANGHAI JIAO TONG UNIV