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SQUID chip pressure welding device and pressure welding method

A chip and fixing device technology, applied in the field of superconducting quantum interference device chip bonding devices, can solve the problems affecting the spatial resolution of scanning SQUID microscopes, high operator proficiency requirements, and thin conductive connecting lines, etc. Resolution, increase magnetic field resolution, eliminate the effect of distance

Pending Publication Date: 2021-12-14
NINGBO UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The application of this method to the scanning SQUID microscope chip has the following disadvantages: mainly, 1) the conductive connecting wire (aluminum wire or gold wire) drawn from the chip pad will form a bending height of tens of um, which will affect the subsequent scanning SQUID microscope space resolution; for its detailed reasons, please refer to the background technology part of the patent application description entitled "A SQUID chip and magnetic microscope probe and its packaging method" filed by the applicant on the same day as this application
Secondly, 2) The conductive connecting wire is very thin, and the operation is difficult. When bonding hard materials, it is easy to block the outlet; 3) Manually operate the bonding machine for bonding operations, which requires a high level of proficiency for the operator; 4) Bonding machine once operation can only complete the bonding of one pad

Method used

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  • SQUID chip pressure welding device and pressure welding method
  • SQUID chip pressure welding device and pressure welding method
  • SQUID chip pressure welding device and pressure welding method

Examples

Experimental program
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Embodiment 1

[0048] Embodiment of the present invention one SQUID chip bonding device such as figure 1 As shown, for the figure 2 The shown SQUID chip 1 is welded on the PCB board 2 , and the welding pad 3 of the SQUID chip 1 is electrically connected with the corresponding welding pad 3 of the PCB board 2 . Such as figure 1 As shown, the SQUID chip pressure welding device includes a PCB fixing device for fixing the PCB board 2, the PCB fixing device is fixedly installed on the fixing bracket 4, corresponds to the position of the PCB fixing device, and is provided with a drive device 5 that can be used for linear sliding The push rod 6, the PCB fixing device is provided with a surface-contact pressure sensor 7, the push rod 6 includes a chip push head 8 on its top, and the top of the chip push head 8 is provided with a chip receiving groove 9 corresponding to the SQUID chip 1. The driving device 5 generally includes a motor and a slide driven by it; it may also be an oil cylinder or an ...

Embodiment 2

[0071] Such as Figure 11 to Figure 17 As shown, the main difference between the second embodiment and the first embodiment is that the object is directly the cold finger 26 , an important component of the magnetic microscope probe.

[0072] Such as Figure 11 As shown, the top of the cold finger 26 is square, and the top of the cold finger 26 is provided with non-penetrating grooves 27 inwards from the near left side of its 4 sides, or the top of the cold finger 26 is opened from the near right side of its 4 sides. A non-penetrating groove 27 is provided inwardly. The non-penetrating slots 27 do not communicate with each other, and each non-penetrating slot 27 is equipped with a square copper pin 28 with a rectangular cross section. Such as Figure 12 As shown, one of the four surfaces of the square copper pin 28 in the length direction is a conductive surface 29, and the other three surfaces are insulating surfaces 30, and the three insulating surfaces 30 are all coated w...

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Abstract

The invention provides an SQUID chip pressure welding device and a pressure welding method. The pressure welding device comprises a PCB fixing device and a surface contact type pressure sensor (7). A pushing rod (6) which can be driven by a driving device (5) to linearly slide is arranged corresponding to the position of the PCB fixing device; the pushing rod (6) comprises a chip pushing head (8) located at the top of the pushing rod (6), and a chip containing groove (9) is formed in the top end of the chip pushing head (8); the pressure welding method comprises the steps that the electric leading-out end of the chip (1) and the electric access end of the PCB (2) are arranged to be corresponding welding discs (3) with the same number; anisotropic conductive adhesive (18) is selected and heated to 100-200 DEG C, and the chip (1) is pressure-welded to a corresponding position of the PCB (2), so the conductive adhesive (18) between the corresponding welding discs (3) reaches a set compression degree and is electrically connected. According to the invention, a conductive adhesive pressure welding mode is used, the problem that a lead is reserved on a bonding pad in the prior art is eliminated, and the operation efficiency is improved.

Description

Technical field: [0001] The invention relates to a superconducting quantum interference device (Superconducting Quantum Interference Device, SQUID for short) chip pressure welding device and pressure welding method. Background technique: [0002] Magnetic microscope, also called scanning SQUID microscope. Among the current magnetic detection instruments, the magnetic microscope is the most sensitive because of its high spatial resolution and magnetic field resolution; it has very high requirements for the welding method of its SQUID chip and the design accuracy of the magnetic microscope probe. The SQUID chip includes a substrate layer, an insulating layer, and a Josephson junction layer sandwiched between the substrate layer and the insulating layer as the core magnetic flux sensing area of ​​the SQUID chip. The sensitive source of the magnetic microscope is the Josephson junction layer as the core magnetic flux sensing area of ​​the SQUID chip. Junction layer. During det...

Claims

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Application Information

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IPC IPC(8): H01L39/02H01L39/06H01L39/24H05K13/04B23K20/02B23K20/26
CPCH05K13/0465B23K20/023B23K20/26H05K2203/04H10N60/805H10N60/82H10N60/0801
Inventor 王海朱浩波李子豪孔祥燕
Owner NINGBO UNIV