Light diffusion plate of direct type backlight module and manufacturing method of light diffusion plate
A light diffusion plate and backlight module technology, which is applied in optics, optical components, instruments, etc., can solve the problems that the number of refractions cannot be exported, the astigmatism efficiency of the light diffusion plate is low, and the flexibility of the light diffusion plate is poor, so as to protect the material Avoid, enhance the light scattering efficiency, increase the effect of flexibility
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0023] Embodiment 1: A method of manufacturing a light diffusion plate of a direct-type backlight module, the specific method of manufacturing is as follows:
[0024] A. Pour 90% of optical-grade PC particles or optical-grade PMMA particles and 5.8% of titanium dioxide into the material mixing drum for stirring, and heat to 220°C-250°C during the stirring process, and keep the temperature in the material mixing drum for 30- 60 minutes until the material is completely melted;
[0025] B. When the material in the material mixing drum is completely melted, add 1% of the silicone particles and 0.3% of the binder for continuous stirring, keep the temperature heated to 250°C-320°C, and keep the temperature for 30-60 minutes;
[0026] C. When the material in the material stirring is completely melted, add 0.4% styrene copolymer and 1% ink for stirring, and at the same time reduce the temperature in the material mixing drum to 200°C-250°C, and keep stirring for 30-60 minutes;
[0027...
Embodiment 2
[0030] Embodiment 2: A method of manufacturing a light diffusion plate of a direct-type backlight module, the specific method of manufacturing is as follows:
[0031] A. Pour 90.5% of optical-grade PC particles or optical-grade PMMA particles and 3.9% of titanium dioxide into the material mixing drum for stirring, and heat to 220°C-250°C during the stirring process, and keep the temperature in the material mixing drum for 30- 60 minutes until the material is completely melted;
[0032] B. When the material in the material mixing drum is completely melted, add 1.5% of silicone particles and 0.35% of binder and continue to stir, keep the temperature heated to 250°C-320°C, and keep the temperature and keep stirring for 30-60 minutes;
[0033] C. When the material in the material stirring is completely melted, add 0.6% styrene copolymer and 1.35% ink for stirring, and at the same time reduce the temperature in the material mixing drum to 200°C-250°C, and continue stirring for 30-6...
Embodiment 3
[0037] Embodiment 3: A method of manufacturing a light diffusion plate of a direct-type backlight module, the specific method of manufacturing is as follows:
[0038] A. Pour 91% of optical grade PC particles or optical grade PMMA particles and 2% of titanium dioxide into the material mixing drum for stirring, and heat it to 220°C-250°C during the stirring process, keep the temperature in the material mixing drum and heat for 30- 60 minutes until the material is completely melted;
[0039] B. When the material in the material mixing drum is completely melted, add 2% of silicone particles and 0.3%-0.6% of binder to continue stirring, keep the temperature heated to 250°C-320°C, and keep stirring for 30-60 minutes ;
[0040] C. When the material in the material stirring is completely melted, add 0.8% styrene copolymer and 1.5% ink for stirring, and at the same time reduce the temperature in the material mixing drum to 200°C-250°C, and continue stirring for 30-60 minutes;
[004...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com