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High-frequency transformer, and packaging method and application thereof

A technology of high-frequency transformer and packaging method, which is applied in the direction of fixed transformer or mutual inductance, transformer/inductance parts, inductance/transformer/magnet manufacturing, etc., which can solve stress, uneven electric field distribution, partial discharge, insulation failure breakdown And other issues

Pending Publication Date: 2021-12-21
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects of internal stress and uneven distribution of electric field in the packaged high-frequency transformer in the prior art, which are prone to partial discharge, which in turn leads to insulation failure and breakdown, thereby providing a high-efficiency Frequency transformer and its packaging method and application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] This embodiment provides a high-frequency transformer packaging method, including the following steps:

[0102] 1. Assemble the iron core, coil, cooling water pipe, glass fiber mesh cloth and semi-conductive paper and place them in the mold, then preheat the mold at 85°C for 10 hours to obtain the preheated mold;

[0103] 2. Mix the two components of epoxy resin S-214A and curing agent S-214B of SASM (Shanghai) New Material Technology Co., Ltd., with a mass ratio of 1:1, and mix them evenly at 65°C, then perform degassing treatment, degassing The air pressure is 300Pa, and the degassing time is 20min. The degassed packaging material is poured into the preheated mold by pouring. The pouring temperature is 65°C and the pressure is 300Pa. The pouring is completed within 30 minutes. After completion, the pressure is maintained for 30 minutes and pressurized to 2×10 5 Pa, keep 30min, obtain the mold after filling.

[0104] 3. Move the filled mold into a curing oven, cure a...

Embodiment 2

[0106] This embodiment provides a high-frequency transformer packaging method, including the following steps:

[0107] 1. Assemble the iron core and coil and place them in the mold, then preheat the mold at 90°C for 15 hours to obtain the preheated mold;

[0108] 2. Mix the two components of epoxy resin S-214A and curing agent S-214B of Saisimai (Shanghai) New Material Technology Co., Ltd., with a mass ratio of 1:1, and mix them evenly at 70°C, and then perform degassing treatment. The air pressure is 800Pa, and the degassing time is 10min. The degassed packaging material is poured into the preheated mold by pouring. The pouring temperature is 70°C and the pressure is 800Pa. The pouring is completed within 60 minutes. After completion, the pressure is maintained for 60 minutes and pressurized to 1.5×10 5 Pa, keep 10min, get the mold after filling.

[0109] 3. Move the filled mold into a curing oven, cure at 70°C for 4 hours, then raise the temperature to 130°C for 20 hours, ...

Embodiment 3

[0111] This embodiment provides a high-frequency transformer packaging method, including the following steps:

[0112] 1. Assemble the iron core, coil, cooling water pipe and glass fiber mesh cloth and place them in the mold, then preheat the mold at 95°C for 12 hours to obtain the preheated mold;

[0113] 2. Mix the two components of epoxy resin S-214A and curing agent S-214B of Saisimai (Shanghai) New Material Technology Co., Ltd., with a mass ratio of 1:1, and mix them evenly at 70°C, and then perform degassing treatment. The air pressure is 100Pa, and the degassing time is 20min. The degassed packaging material is poured into the preheated mold by pouring. The pouring temperature is 66°C and the pressure is 530Pa. The pouring is completed within 35 minutes. After completion, the pressure is maintained for 35 minutes and pressurized to 3×10 5 Pa, keep 30min, obtain the mold after filling.

[0114] 3. Move the filled mold into a curing oven, cure at 90°C for 3 hours, then ...

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Abstract

The invention belongs to the technical field of transformer packaging, and particularly relates to a high-frequency transformer, and a packaging method and an application thereof. The packaging method comprises the following steps: placing high-frequency transformer accessories in a mold, filling the mold with a packaging material, curing, demolding, cooling to a room temperature, and carrying out temperature treatment, wherein the temperature treatment is carried out in any one of the following modes: mode 1: cooling to -30 to -20 DEG C and keeping for 1-24 hours, heating to -10 to 10 DEG C and keeping for 1-24 hours, and heating to 80 to 120 DEG C and keeping for 1-72 hours; mode 2: cooling to -30 to -20 DEG C, keeping for 1-24 hours, heating to 80-120 DEG C, and keeping for 1-72 hours; mode 3: raising the temperature to 80-120 DEG C, and keeping the temperature for 1-72 hours; and mode 4: heating to 80-120 DEG C, keeping for 1-72 hours, cooling to -30--20 DEG C, and keeping for 1-24 hours. According to the packaging method provided by the invention, after curing is completed, temperature treatment is carried out so that an internal stress of the high-frequency transformer can be redistributed, electric field distortion caused by stress concentration is reduced, partial discharge is reduced, and the packaging method is suitable for packaging of the high-frequency transformer.

Description

technical field [0001] The invention relates to the technical field of transformer packaging, in particular to a high-frequency transformer and its packaging method and application. Background technique [0002] High-frequency transformers are based on power electronic conversion technology and electromagnetic induction principles, and can flexibly realize power flow and power quality control. They are key components in DC / DC converters, the core equipment of distributed smart grids. , transmission power and other key functions, the high-frequency transformer includes an iron core and a coil, and the iron core and the coil need to be packaged with packaging materials to achieve insulation and fixation. [0003] At present, the most commonly used packaging material is epoxy resin. Epoxy resin insulation material is used as the main insulation material of high-frequency transformers. It has excellent mechanical properties, high dielectric properties, surface leakage resistance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F41/12H01F27/32H01F27/34H01F19/04
CPCH01F41/127H01F41/125H01F27/324H01F19/04H01F27/34
Inventor 陈赟杨威尹立张翀张卓颜丙越王琨田野刘一涛
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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