The invention belongs to the technical field of transformer packaging, and particularly relates to a high-frequency transformer, and a packaging method and an application thereof. The packaging method comprises the following steps: placing high-frequency transformer accessories in a mold, filling the mold with a packaging material, curing, demolding, cooling to a room temperature, and carrying out temperature treatment, wherein the temperature treatment is carried out in any one of the following modes: mode 1: cooling to -30 to -20 DEG C and keeping for 1-24 hours, heating to -10 to 10 DEG C and keeping for 1-24 hours, and heating to 80 to 120 DEG C and keeping for 1-72 hours; mode 2: cooling to -30 to -20 DEG C, keeping for 1-24 hours, heating to 80-120 DEG C, and keeping for 1-72 hours; mode 3: raising the temperature to 80-120 DEG C, and keeping the temperature for 1-72 hours; and mode 4: heating to 80-120 DEG C, keeping for 1-72 hours, cooling to -30--20 DEG C, and keeping for 1-24 hours. According to the packaging method provided by the invention, after curing is completed, temperature treatment is carried out so that an internal stress of the high-frequency transformer can be redistributed, electric field distortion caused by stress concentration is reduced, partial discharge is reduced, and the packaging method is suitable for packaging of the high-frequency transformer.