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Device and method for realizing one-time screen printing function through screen attaching and secondary coating

A secondary coating and screen printing technology, applied in printed circuit, printed circuit manufacturing, removal of conductive materials by chemical/electrolytic methods, etc., can solve the problem of solder resist screen printing characters, different thickness of white oil blocks, Cost increase, cumbersome and complicated problems, to achieve the effect of reducing labor costs, reducing material costs, and meeting customer needs

Active Publication Date: 2021-12-28
吉安新宇腾跃电子有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0004]At present, the thickness of solder resist screen printing characters and white oil blocks is different, which is cumbersome and complicated, and the cost in disguise is increased

Method used

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  • Device and method for realizing one-time screen printing function through screen attaching and secondary coating
  • Device and method for realizing one-time screen printing function through screen attaching and secondary coating
  • Device and method for realizing one-time screen printing function through screen attaching and secondary coating

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-Figure 5 , the present invention provides the following technical solutions: a screen lamination device for secondary coating to realize the one-time screen printing function, which has: a screen body 1 and a screen tray 2, and the top surface of the screen tray 2 is used to The slot 3 for carrying the stencil body 1, the stencil body 1 includes a stencil substrate 101 at the bottom, a photosensitive water film 102 attached to the stencil ...

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Abstract

The invention belongs to the technical field of FPC solder resist printing, and particularly relates to a device for realizing a one-time screen printing function through screen attaching and secondary coating. The device is provided with a screen body and a screen tray, and the top surface of the screen tray is provided with a containing groove. The method comprises the steps that the screen body is placed in the containing groove and fixed through a fixing assembly; a layer of photosensitive water film is attached to the surface of the screen body, and then primary local exposure is carried out; and the photosensitive water film subjected to primary local exposure is coated with a layer of photosensitive resist, and then secondary local exposure is carried out. According to the processing method, a layer of photosensitive water film is attached to an existing screen, local exposure is carried out, then photosensitive glue is coated, secondary coating is carried out, and local exposure is carried out, so the one-time screen printing function is achieved, the customer requirement is met, the product efficiency is improved, the one-machine multifunctional printing effect is achieved, meanwhile, the labor cost is reduced by 50%, the material cost is reduced by 50%, and the product productivity is synchronously improved by 50%.

Description

technical field [0001] The invention belongs to the technical field of FPC solder resist printing, and in particular relates to a device for realizing the function of one-time screen printing by laminating the screen for secondary coating, and also relates to a device for laminating the screen for secondary coating to realize one-time screen printing method of function. Background technique [0002] FPC is a flexible printed circuit board, which is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, with high wiring density, light weight, and thin thickness. , Good bendability, by embedding a circuit design on a bendable thin plastic sheet, a large number of precision components can be stacked in a narrow and limited space, thereby forming a bendable flexible circuit, which can be bent at will , Folding light weight, small size, good heat dissipation, easy installation, breaking through the traditional interconnection technolo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/12
CPCH05K3/068H05K3/1216Y02P70/50
Inventor 景悍
Owner 吉安新宇腾跃电子有限公司
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