Diamond wire cutting machine for solar grade silicon wafer

Abstract

The invention discloses a diamond wire cutting machine for a solar grade silicon wafer. The diamond wire cutting machine comprises a cutting box, a cutting cavity is formed in the cutting box, two sliding grooves are formed in the rear wall of the cutting cavity, guide rods are fixedly connected into the sliding grooves, and electric sliding rails are slidably connected to the guide rods; through the cooperation of a filtering hydraulic rod and an extrusion block, chippings left during silicon material cutting are flushed through cooling liquid, meanwhile, the chippings are filtered and recycled, the situation that the chippings are doped in the recycled cooling liquid, and consequently the service life of the equipment is shortened is avoided, and when wire cutting equipment works, a sealing plate is matched with a damping liquid tank to assist the wire cutting equipment to reduce vibration, unload force and improve cutting accuracy, a self-sucking pump is matched with a cleaning spray head, so that a cutting clamp is scoured in real time, cutting is prevented from being interfered by machining chippings, and the cutting efficiency is improved.

Description

technical field [0001] The invention relates to the related field of wire cutting machines, in particular to a diamond wire cutting machine for solar-grade silicon wafers. Background technique [0002] The diamond wire cutting machine adopts the one-way circulation or reciprocating circulation of the diamond wire to form a relative grinding motion between the diamond wire and the object to be cut, so as to achieve the purpose of cutting. Its cutting principle is similar to that of a bow saw. important tool. [0003] However, the existing diamond wire cutting machine will generate vibration during cutting, which affects the processing accuracy and effect to a certain extent, and there is no proper way to deal with the debris generated by cutting silicon materials, which may easily cause blockage and equipment damage. Contents of the invention [0004] The purpose of the present invention is to address the above-mentioned problems that exist in the prior art, and a kind of ...

AI Technical Summary

Problems solved by technology

[0003] However, the existing diamond wire cutting machine will generate vibration during cutting, which affects the processing accuracy and effect to a certain extent, and there is no proper way to deal with the debris generated by cutting silicon materials, which may easily cause blockage and equipment damage

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