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Power module and method for packaging power module

A technology of power modules and conductive layers, applied in the field of electronic power devices, can solve the problems of large area of ​​the printed circuit board of the controller, difficult module positioning and installation, and difficult wiring of the controller, etc., so as to achieve convenient wiring and reduce wiring. The effect of reducing difficulty and positioning difficulty

Pending Publication Date: 2021-12-31
GREE ELECTRIC APPLIANCES INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This solution occupies a large area of ​​the printed circuit board of the controller, and the cost is high; and the wiring of the controller is difficult, and extending the wiring distance will increase the parasitic parameters
In addition, the problem of electromagnetic compatibility is difficult to solve; the positioning and installation of modules is difficult, and the production efficiency is low

Method used

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  • Power module and method for packaging power module
  • Power module and method for packaging power module
  • Power module and method for packaging power module

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Embodiment Construction

[0030] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0031] A power module 1 according to an embodiment of the present invention is described below with reference to the drawings.

[0032] Such as Figure 2-Figure 4 As shown, the power module 11 according to the embodiment of the present invention includes: a frame 10 , a substrate 20 , a diode unit 30 and an IGBT unit 40 .

[0033] Specifically, the frame 10 is provided with a plurality of pins; the substrate 20 is embedded in the frame 10; the diode unit 30 and the IGBT unit 40 are spaced apart on the substrate 20, wherein the anode of ...

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Abstract

The invention discloses a power module and a method for packaging the power module, and belongs to the technical field of electronic power devices, and the power module comprises a frame which is provided with a plurality of pins; a base plate, embedded in the frame; a diode unit and an IGBT unit, arranged on the substrate at intervals, an anode of the diode unit and a collector electrode of the IGBT unit being connected in parallel and are jointly electrically connected with one pin, and a cathode of the diode unit, an emitting electrode of the IGBT unit and a gate electrode of the IGBT unit being electrically connected with the rest of the pins respectively. According to the power module disclosed by the invention, the IGBT unit and the diode unit are integrated into one power module, so that the area of a controller PCB is greatly reduced, the wiring of the power module is more convenient, in addition, when the power module is applied to a circuit, the positioning difficulty is greatly reduced, and the production efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of electronic power devices, and in particular relates to a power module and a method for packaging the power module. Background technique [0002] In order to improve the efficiency of the electric equipment, it is often required to perform power factor correction (PowerFactorCorrection, PFC) on the power supply that provides electric energy for the electric equipment. Among them, the power factor is a parameter to measure the power consumption efficiency of electric equipment, and usually refers to the ratio of effective power divided by apparent power. The larger the power factor value, the higher the power consumption efficiency of the electrical equipment. The technology of improving the power factor of electrical equipment is called power factor correction. In the traditional method, an active power factor correction step-up chopper circuit (Boost step-up circuit) is used for power factor correction....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L25/18H01L21/60
CPCH01L25/18H01L25/50H01L23/4952H01L23/49575H01L2224/49111H01L2224/48247
Inventor 宋蒙恩许敏雷龙颜权枫方明占瞿浩
Owner GREE ELECTRIC APPLIANCES INC
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