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Superlattice ultra-large scale integrated circuit

A large-scale integrated circuit and super-lattice technology, which is applied in the direction of circuits, electrical components, and electrical solid-state devices, can solve problems that are difficult to meet, and achieve the effects of short production cycle, simplified process steps, and high reliability and resistance to high and low temperatures

Active Publication Date: 2021-12-31
林和
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

More importantly, silicon VLSI components have become more and more difficult to meet the special requirements of artificial intelligence and space age for ultra-high speed, high and low temperature resistance, and radiation resistance.

Method used

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  • Superlattice ultra-large scale integrated circuit
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  • Superlattice ultra-large scale integrated circuit

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Experimental program
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Embodiment Construction

[0179] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0180] Embodiments of the present invention provide superlattice VLSI, such as figure 1 shown, including:

[0181] substrate1;

[0182] a transition layer 2 disposed above the substrate 1;

[0183] The component layer 3 is arranged above the transition layer 2, and the component layer 3 is a device designed based on the special properties of the two-dimensional electron gas and the two-dimensional hole gas of the super-lattice integrated circuit to construct the super-lattice integrated circuit.

[0184] The working principle and beneficial effect of the above-mentioned superlattice VLSI:

[0185] Above the transition layer, a superlattice integrated circuit is c...

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Abstract

The invention provides a superlattice ultra-large scale integrated circuit. The superlattice ultra-large scale integrated circuit comprises a substrate, a transition layer and acomponent layer, wherein the transition layer is arranged above the substrate; and the component layer is arranged above the transition layer, and the component layer is a device designed based on the special performance of the two-dimensional electron gas and the two-dimensional hole gas of the superlattice integrated circuit to construct the superlattice integrated circuit. The superlattice integrated circuit is constructed above the transition layer by using a device designed based on the special performance of the two-dimensional electron gas and the two-dimensional hole gas of the superlattice integrated circuit. The superlattice ultra-large scale integrated circuit (MDMFSL-ULSI: Multi-Dimension Multi-Functional Superlattice Ultra-Large Scale Integrated Circuit) is designed on the basis of two-dimensional electron gas and two-dimensional hole gas superlattice and a quantum well, has the characteristics of superspeed, high reliability, radiation resistance, high and low temperature resistance and the like, and is high in design efficiency, short in manufacturing process period, low in cost and the defects of the traditional silicon and compound integrated circuit are greatly improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a superlattice VLSI. Background technique [0002] At present, VLSI components and processes based on silicon materials are approaching the quantum limit. Not only are the device performance limited, but the manufacturing process is very complicated and expensive. The rapidly developing big data, artificial intelligence and comprehensive data intelligence market urgently needs VLSI with high reliability and acceptable cost. More importantly, silicon VLSI components have become increasingly difficult to meet the special requirements of artificial intelligence and space age for ultra-high speed, high and low temperature resistance, and radiation resistance. Contents of the invention [0003] The present invention provides a superlattice ultra-large scale integrated circuit (MDMFSL-ULSI: Multi-DimensionMulti-Functional Superlattice Ultra-Large Scale Integrated Circuit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/15H01L29/93H01L29/732H01L29/735H01L29/78H01L29/86H01L29/8605H01L27/02
CPCH01L29/15H01L29/157H01L29/93H01L29/86H01L29/8605H01L29/732H01L29/735H01L29/78H01L29/78391H01L27/0207
Inventor 林和
Owner 林和