Horizontal copper deposition device for printed circuit board manufacturing

Abstract

The invention relates to the technical field of printed circuit board manufacturing, in particular to a horizontal copper deposition device for printed circuit board manufacturing. The device comprises a horizontal copper deposition liquid tank, a liquid pumping pipe is mounted at the bottom of the horizontal copper deposition liquid tank, one end, far away from the horizontal copper deposition liquid tank, of the liquid pumping pipe is connected with a liquid inlet end of a circulating pump, and a liquid delivery pipe is mounted at a liquid outlet end of the circulating pump. The end, away from the circulating pump, of the liquid delivery pipe extends to the lower portion in the barrel, the upper end of the barrel is open and fixedly connected with a horn mouth with the wide upper portion and the narrow lower portion, the horn mouth is sleeved with a conical cover with the wide upper portion and the narrow lower portion, the barrel is sleeved with a floating plate capable of sliding up and down along the barrel, and a thick vinylon cloth block is laid on the floating plate. Compared with the prior art, the device has the following beneficial effects that bubbles caused by too high backflow speed of the horizontal copper deposition liquid are prevented, the influence on the horizontal copper deposition processing effect of the printed circuit board is reduced to the maximum extent, and the reject ratio of the printed circuit board is reduced.

Description

technical field [0001] The invention relates to a horizontal copper sinking device for making printed circuit boards, belonging to the technical field of printed circuit boards. Background technique [0002] The horizontal copper sinking process is widely used in the production and processing of printed circuit boards. Its main purpose is to deposit a layer of copper on the non-conductive substrate through a series of chemical treatment methods, and then thicken it through subsequent electroplating methods to achieve the designed specific thickness. At present, in order to fully contact the horizontal copper deposition liquid with the printed circuit board, a circulating pump is often used to circulate the horizontal copper deposition liquid in the horizontal copper deposition liquid tank, but the horizontal copper deposition liquid that flows into the horizontal copper deposition liquid tank again Due to the large flow rate, it is easy to cause bubbles in the horizontal co...

AI Technical Summary

Problems solved by technology

At present, in order to fully contact the horizontal copper deposition liquid with the printed circuit board, a circulating pump is often used to circulate the horizontal copper deposition liquid in the horizontal copper deposition liquid tank, but the horizontal copper deposition liquid that flows into the horizontal copper deposition liquid tank again Due to the high flow rate, it is easy to cause bubbles in the horizontal copper sinking liquid in the horizontal copper sinking liquid tank, which affects the effect of the horizontal copper sinking process of the printed circuit board and increases the failure rate of the printed circuit board

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