Chemical mechanical polishing head and polishing system
A technology of chemical machinery and polishing head, which is applied in the direction of grinding/polishing equipment, grinding machine tools, and parts of grinding machine tools, etc. It can solve problems such as unfavorable industrialization, affecting material removal rate, and increasing the difficulty of pressure regulation in the edge area of wafers, etc. , to achieve the effect of improving uniformity, reducing the difficulty of polishing control, and achieving planarization
Active Publication Date: 2022-01-04
华海清科(北京)科技有限公司
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Problems solved by technology
However, due to the large difference in the pressure response characteristics corresponding to the partitions at the edge of the diaphragm, and the spacer ribs set to form the edge partitions will also affect the material removal rate, which virtually increases the difficulty of pressure regulation at the edge of the wafer. Industrialization that is not conducive to global flattening
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[0034] The technical solutions of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings. The examples described here are specific implementations of the present invention and are used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the implementation of the present invention and the protection scope of the present invention . In addition to the embodiments described here, those skilled in the art can also adopt other obvious technical solutions based on the claims of the application and the contents disclosed in the specification, and these technical solutions include adopting any modifications made to the embodiments described here. Obvious alternatives and modified technical solutions.
[0035] The accompanying drawings in this specification are schematic diagrams, which assist in explaining the concept of the...
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The invention discloses a chemical mechanical polishing head and a polishing system. The chemical mechanical polishing head comprises a coupling disc, a bearing disc, an elastic film and a retaining ring, wherein the bearing disc is fixed to the coupling disc through a connecting film, the elastic film is arranged at the bottom of the bearing disc through a fixing pressing ring, and the retaining ring is arranged on the peripheral side of the elastic film and located at the bottom of the bearing disc. The chemical mechanical polishing head further comprises an annular film which is fixed to the bottom of the bearing disc and located on the upper side of the elastic film. The pressurized annular film abuts against the top of the elastic film, so that the load applied by the annular film can be transmitted downwards through the elastic film.
Description
technical field [0001] The invention belongs to the technical field of chemical mechanical polishing, and in particular relates to a chemical mechanical polishing head and a polishing system. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in promoting the transformation and upgrading of the manufacturing industry to digital and intelligent. A chip is the carrier of an integrated circuit, and chip manufacturing involves technological processes such as chip design, wafer manufacturing, wafer processing, electrical measurement, cutting, packaging, and testing. Among them, chemical mechanical polishing belongs to the wafer manufacturing process. [0003] Chemical Mechanical Planarization (CMP) is a globally planarized ultra-precision surface processing technology. In chemical mechanical polishing, the wafer is usually attracted to the bottom surface of the carrier head, and the side of the w...
Claims
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IPC IPC(8): B24B37/00B24B37/20B24B37/34B24B53/12
CPCB24B37/00B24B37/20B24B37/34B24B53/12
Inventor 孟松林
Owner 华海清科(北京)科技有限公司