Light-emitting device

A technology of light-emitting devices and light-emitting elements, which is applied in the direction of lighting devices, light sources, components of lighting devices, etc., and can solve problems such as failure of light-emitting elements

Pending Publication Date: 2022-01-11
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For example, in the case of the LED lighting device of Patent Document 1, if power is supplied to the light-emitting element and the light-emitting element continues to emit light, there is a possibility that the light-emitting element may fail due to heat generated by the light emission.

Method used

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Examples

Experimental program
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Effect test

no. 1 Embodiment approach 》

[0042] Below, refer to Figure 1A ~ Figure 4 The first embodiment will be described. First, refer to Figure 1A as well as Figure 1B The function and configuration of the light emitting device 100 of this embodiment will be described. Next, refer to image 3 The light emitting operation of the light emitting device 100 of this embodiment will be described. Next, effects of this embodiment will be described.

[0043]

[0044] The light emitting device 100 of the present embodiment has a function of emitting light by causing the light emitting substrate 10 to emit light. For example, the light emitting device 100 is used as a lighting device.

[0045] The light emitting device 100 includes a light emitting substrate 10, a flat heat pipe 40 (an example of a flat heat pipe mechanism), a cooling fan 50 (an example of a cooling unit), a case 60 (an example of a housing unit), a power supply (not shown), a switch (Illustration omitted).

[0046] Here, the light emitting sub...

no. 2 Embodiment approach 》

[0141] Next, refer to Figure 5A as well as Figure 5B A second embodiment will be described. Hereinafter, only the present embodiment and the first embodiment (refer to Figure 1A , Figure 1B etc.) are explained in different parts.

[0142]

[0143] The light emitting device 100A of this embodiment has the light emitting device 100 of the first embodiment as a basic structure, and further includes a heat sink 70

[0144] Here, the heat sink 70 has a function of dissipating part of the heat taken away from the light emitting substrate 10 by the flat heat pipe 40 . The heat sink 70 is arranged on the side opposite to the light emitting substrate 10 across the flat heat pipe 40 , and is in contact with the first flat plate portion 44 of the flat heat pipe 40 . As an example, the fins 70 are composed of a plurality of plates, protrude in the plate thickness direction of the first flat plate portion 44 similarly to the second flat plate portion 46 , and are arranged along t...

no. 3 Embodiment approach 》

[0154] Next, refer to Figure 6A as well as Figure 6B A second embodiment will be described. Hereinafter, only the present embodiment and the second embodiment (refer to Figure 5A as well as Figure 5B etc.) are explained in different parts.

[0155]

[0156] Like the light emitting device 100A of the second embodiment, the light emitting device 100B of the present embodiment has the light emitting device 100 of the first embodiment as a basic configuration and further includes a heat sink 70 .

[0157] However, in the case of this embodiment, the posture of attaching the flat heat pipe 40 to the plate 66 is different from that of the second embodiment. Specifically, the flat heat pipe 40 of the present embodiment is attached to the plate 66 so that the second flat portion 46 is located on the side opposite to the side of the cooling fan 50 . Therefore, in the present embodiment, the heat sink 70 is disposed between the second flat plate portion 46 and the cooling fan...

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Abstract

A light-emitting device (100) is provided with a light-emitting substrate (10) having an insulating substrate (32), a circuit pattern layer (34) disposed at one side of the insulating substrate (32), and at least one light-emitting element (20) joined to the circuit pattern layer (34); a flat heat pipe mechanism (40) for drawing heat away from the light-emitting substrate (10) which increases in temperature when the at least one light-emitting element (20) emits light; and a cooling unit (50) for cooling the flat heat pipe mechanism (40).

Description

technical field [0001] The present invention relates to light emitting devices. Background technique [0002] Patent Document 1 discloses an LED lighting device including a substrate on which light emitting elements (LED elements) are mounted. [0003] Patent Document 1: Chinese Patent Publication No. 106163113 [0004] For example, in the case of the LED lighting device of Patent Document 1, if power is supplied to the light-emitting element to continue to emit light, the light-emitting element may malfunction due to heat generated by the light emission. Contents of the invention [0005] An object of the present invention is to provide a light-emitting device including a light-emitting substrate having an insulating substrate and a plurality of light-emitting elements, which can appropriately remove heat from the light-emitting substrate that increases in temperature accompanying the above-mentioned light emission. [0006] A light-emitting device according to a first ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/50H01L25/075F21V29/503F21V29/51F21V29/67F21V29/76F21Y115/10
CPCH01L33/642H01L33/648H01L33/64H01L33/502H01L33/504H01L25/0753F21V29/503F21V29/51F21V29/763F21V29/677F21Y2115/10H01L33/00H01L33/50F21S2/005F21V29/67F21V29/76F21V9/32H01L33/507F21V9/40F21V19/0015
Inventor 小西正宏
Owner DENKA CO LTD
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