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Automatic laser processing equipment platform and processing method

A laser processing and equipment platform technology, applied in laser welding equipment, metal processing equipment, welding equipment, etc., can solve the problems of low processing precision, accurate positioning, and low degree of automation, and achieve the effect of reducing vibration and maintaining the level

Pending Publication Date: 2022-01-14
苏州科韵激光科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The processing platform in the existing technology cannot automatically locate the defective parts of the workpiece, and cannot accurately locate the workpiece through coordinates. Therefore, the processing accuracy of the existing equipment is not high, the degree of automation is not high, and the processing cost is high.

Method used

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  • Automatic laser processing equipment platform and processing method
  • Automatic laser processing equipment platform and processing method
  • Automatic laser processing equipment platform and processing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] An automatic laser processing equipment platform, such as figure 1 As shown, it includes a base 1, a workbench 2, a camera assembly 3 and a laser assembly 4. The workbench 2 is arranged on the base 1, and the camera assembly 3 and the laser assembly 4 are correspondingly arranged above the workbench 2. The base 1 and the workbench There is a sliding connection between the tables 2, and the workpiece is placed on the work table 2. For example, when processing and inspecting the liquid crystal panel, the controller is first turned on, and the controller is connected to the workpiece to realize the signal connection of the workpiece, and then the adjusted camera component 3 starts to detect and capture the workpiece, and captures the signal of the defective part on the workpiece, which will be captured The signal is transmitted to the controller, and the controller controls the laser assembly 4 to process the workpiece.

[0033] Specifically, a first guide rail 101 and a ...

Embodiment 2

[0044] Corresponding to the above-mentioned embodiments, a processing method based on the above-mentioned automatic laser processing equipment platform includes: placing the workpiece on the workbench 2, adjusting the camera assembly 3 according to the size of the workpiece, so that the camera assembly 3 focuses on the workpiece; Turn on the controller, connect the workpiece through the controller, so that the workpiece maintains a signal connection state, the camera assembly 3 starts to detect the workpiece, the camera assembly 3 captures the signal of the upper defect part of the workpiece, and transmits the captured signal to the controller, The controller controls the laser assembly 4 to process the workpiece.

[0045] The specific working process: the staff places the workpiece to be processed on the workbench 2, adjusts the camera assembly 3 according to the size of the workpiece, specifically adjusts the moving seat 303 to slide along the slide rail 302, and at the same ...

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PUM

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Abstract

The invention discloses an automatic laser processing equipment platform and a processing method, and relates to the technical field of laser processing. The device comprises a base, a working table arranged on the base, a camera assembly and a laser assembly, the camera assembly and the laser assembly are arranged above the working table, the base and the working table are in sliding connection, a workpiece is placed on the working table, the camera assembly is used for capturing the workpiece, captured signals are transmitted to a controller, and the laser assembly is controlled by the controller to machine the workpiece. Defective parts of the workpiece can be automatically captured, coordinate positioning is carried out, follow-up machining is facilitated, the equipment platform can adapt to various workpieces of different sizes, and the machining precision and efficiency of the workpieces are improved through arrangement of the equipment platform.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to an automatic laser processing equipment platform and a processing method. Background technique [0002] The existing semiconductor processing fields, such as wafer cutting, PCB boards, liquid crystal panels, etc., all use laser processing. During the production and processing of liquid crystal panels, it is necessary to inspect the preliminarily processed liquid crystal panels to detect whether the liquid crystal panels are defective. , the detection of non-defective LCD panels can be directly applied to electronic equipment, and the detection of defective panels requires laser repairing equipment for laser repair and detection and positioning of defects on the glass in order to obtain defect-free artifacts. [0003] The processing platform in the existing technology cannot automatically locate the defective part of the workpiece, and cannot accurately locate the workpi...

Claims

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Application Information

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IPC IPC(8): G02F1/13B23K26/00B23K26/70
CPCG02F1/1309B23K26/00B23K26/702
Inventor 鲍国庆李坤
Owner 苏州科韵激光科技有限公司