Electronic packaging solder paste processing device adopting pressurization and gas supply

A processing device and electronic packaging technology, applied in transportation and packaging, dissolution, settling tanks, etc., to achieve the effect of avoiding waste

Inactive Publication Date: 2022-01-18
深圳市鑫富锦新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a solder paste processing device for electronic packaging using pressurization and gas supply to solve the problems mentioned in the above process

Method used

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  • Electronic packaging solder paste processing device adopting pressurization and gas supply
  • Electronic packaging solder paste processing device adopting pressurization and gas supply
  • Electronic packaging solder paste processing device adopting pressurization and gas supply

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] see Figure 1 to Figure 10 , the present invention provides a technical solution: including a processing device, the processing device includes an abrasive assembly with a residual material collection function, a pressurization assembly with an air supply function, and a quantitative addition assembly with a raw material mixing function, and the abrasive assembly includes an abrasive box Body 1, discharge pipeline 11, settling tank 12, gas storage tank ...

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Abstract

The invention relates to the technical field of solder paste processing, in particular to an electronic packaging solder paste processing device adopting pressurization and gas supply. A material grinding assembly comprises a material grinding box body, a discharging pipeline, a settling box, a gas storage tank, a gas outlet pipeline, a gas inlet pipeline, a vibrator, a branch pipeline, a disconnecting plate, a distance increasing partition plate and a collecting frame, the discharging pipeline is fixed to the middle side of the upper end of the material grinding box body through screws, the settling box is fixed to the lower end of the material grinding box body through screws, the gas storage tank is located on one side of the grinding material box body, the gas outlet pipeline is fixed to the middle side of the upper end of the gas storage tank through screws, and the gas inlet pipeline is fixed to the middle side of the lower end of the gas storage tank through screws, so that powdery solder paste can be prevented from directly entering the gas storage tank together with inert gas, waste of the solder paste is avoided, and meanwhile, the powdery solder paste can better fall into the collecting frame through the vibrator.

Description

technical field [0001] The invention relates to the technical field of solder paste processing, in particular to a solder paste processing device for electronic packaging using pressurization and air supply. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. At present, solder paste processing requires the use of intelligent heat treatment production lines. [0003] The existing publication number is: a solder paste processing device of CN107790262A, which drives the eccentric column to rotate through the motor, and the rotation of the eccentric column makes the grinding table rotate in the groove, and the flux and solder powder pass through the first feeding trough, the first feeding The branch chann...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01F33/83B01D21/02B01F33/71B01F35/71
CPCB01D21/02
Inventor 陈加财吴勇
Owner 深圳市鑫富锦新材料有限公司
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