Separation and comparison device for integrated circuit chip production

An integrated circuit and chip technology, applied in the field of separation and comparison devices for integrated circuit chip production, can solve problems such as low degree of automation, endangering the health of workers, and affecting work efficiency, so as to reduce labor intensity and avoid low work efficiency. The effect of improving work efficiency and quality

Pending Publication Date: 2022-01-18
成芯半导体(江苏)有限公司
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  • Abstract
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  • Claims
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Problems solved by technology

[0003] When the general separation and comparison device compares its chips, it is manually observed with the eyes. People will be fatigued after working for a long time, which will affect t

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  • Separation and comparison device for integrated circuit chip production
  • Separation and comparison device for integrated circuit chip production
  • Separation and comparison device for integrated circuit chip production

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[0021] Next, the technical solutions in the embodiments of the present invention will be described in connection with the drawings of the embodiments of the present invention, and it is understood that the described embodiments are merely the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art are in the range of the present invention without making creative labor premise.

[0022] See Figure 1-6 An integrated circuit chip production to more than separating apparatus 1 comprises a conveyor belt, the conveyor belt is fixedly connected to a side of a connecting plate 8, the upper end of the central web 8 is provided with a matching function alignment mechanism 4, the said alignment mechanism 4 includes a placing plate 41, alignment plate 42, controller 43 and positioning pin 44, the alignment means 4 is provided with a storage means 2 side, the upper ...

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Abstract

The invention relates to the field of circuit chip production, in particular to a separation and comparison device for integrated circuit chip production. The separation and comparison device comprises a conveyor belt, a cleaning mechanism comprises a fixed box, a ventilation net and a fan, the other side of a comparison mechanism is provided with a placement mechanism with a sensing function, and the other side of the conveyor belt is provided with a slidable grabbing mechanism. According to the separation and comparison device for integrated circuit chip production, through arrangement of a comparison plate and positioning pins, circuit chip distinguishing and separation do not depend on naked eye distinguishing manually, the situations that the working efficiency is low and the body health of workers is harmed are avoided, the working efficiency and quality are improved, through the arrangement of the cleaning mechanism, sundries in circuit chip holes can be blown off, the situation that the sundries in the holes affect the comparison and separation precision to affect the working efficiency is avoided, through the arrangement of a feeding mechanism and the grabbing mechanism, the circuit chips are taken and reset no longer through manual work, and the labor intensity of the workers is lowered.

Description

technical field [0001] The invention relates to the field of circuit chip production, in particular to a separation and comparison device for integrated circuit chip production. Background technique [0002] An integrated circuit chip is a miniature electronic device or component. It uses a certain process to interconnect components such as transistors, diodes, resistors, capacitors, and inductors required in a circuit, and interconnects them in one or several small pieces. On a semiconductor wafer or a dielectric substrate, and then packaged in a tube shell, it becomes a microstructure with the required circuit function; all the components have been formed into a whole in the structure, so that the volume of the whole circuit is greatly reduced, and the leads and welding The number of points is also greatly reduced, so that electronic components have taken a big step towards miniaturization, low power consumption and high reliability. The integrated circuit chip is actually...

Claims

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Application Information

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IPC IPC(8): B07C5/34B07C5/02B07C5/36B08B5/02
CPCB07C5/34B07C5/02B07C5/362B08B5/02
Inventor 张远骏
Owner 成芯半导体(江苏)有限公司
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