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Manufacturing method of package structure and package structure

A manufacturing method and packaging structure technology, applied to the coupling of optical waveguides, instruments, optical waveguide light guides, etc., can solve the problems of fiber coupling interface damage, fiber coupling interface insertion loss increase, affecting the actual use of optoelectronic chips, etc., to achieve surface purity , Prevention of laser damage, high coupling efficiency

Active Publication Date: 2022-03-08
HANGZHOU GUANGZHIYUAN TECH CO LTD
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Problems solved by technology

However, the optical chip (PIC) has a fiber-coupled interface for inputting light, and directly plastic-encapsulating the surface of the optical chip (PIC) will cause damage to the fiber-coupled interface, which will lead to a substantial increase in the insertion loss of the fiber-coupled interface and affect the optoelectronic chip. actual use of

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  • Manufacturing method of package structure and package structure
  • Manufacturing method of package structure and package structure
  • Manufacturing method of package structure and package structure

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Embodiment Construction

[0045] The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

[0046] In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly c...

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Abstract

The present invention provides a method for manufacturing a packaging structure and a packaging structure, wherein the method includes: making a protective layer covering the fiber coupling region on the fiber coupling region of the first semiconductor chip, and making a protective layer covering the fiber coupling region After the plastic sealing layer is opened, the protective layer covering the fiber coupling area is removed to prevent the optical coupling interface from being damaged by the laser, and at the same time ensure the surface purity of the fiber coupling area, which is conducive to the subsequent optical coupling interface being able to connect with the fiber array. Maintain high coupling efficiency.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a method for manufacturing a packaging structure and the packaging structure. Background technique [0002] With the increasing development of semiconductor technology, packaging structures with high integration density are becoming more and more important. For example, chip-to-chip stacking can be achieved by using a 3D packaging structure. [0003] At present, the electrical chip (electronic integrated chip, EIC, Electronic integrated chip) and optical chip (photonic integrated chip, PIC, Photonic integrated chip) in the existing silicon-based optoelectronic integrated chip adopt different wafer production processes. The connection between the electrical chip (EIC) and the optical chip (PIC) is realized by connecting (such as wire bonding or flip-chip interconnection), forming a three-dimensional interconnection structure. [0004] In the three-dimensional packaging of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/13G02B6/42
CPCG02B6/13G02B6/4296
Inventor 严其新江庐山王宏杰孟怀宇沈亦晨
Owner HANGZHOU GUANGZHIYUAN TECH CO LTD
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