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Headphone deformation simulation detection equipment

A technology for headphone and detection equipment, applied in on-ear/over-ear headphones, earpiece/headphone accessories, amplifiers, etc., can solve the failure of communication harness, inability to compensate for headphone positioning, and inability to adapt to earmuffs Structural deformation test and other problems to achieve the effect of meeting deformation requirements and avoiding damage

Pending Publication Date: 2022-01-21
ZHUHAI BOJAY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the communication harness needs to connect the sound units in the left and right earmuffs through the joint structure and ear straps, the above actions may lead to the failure of the communication harness, and the traditional test device cannot detect the communication performance in this case
There is a Chinese patent with the publication number CN108882138A, which discloses a headset testing robot for embedded computers, which can realize the preliminary bending test of the headset, but can only be adapted to two types of expansion and contraction. Bending mode, unable to adapt to the rotatable earmuff structure and deformation tests of more postures, and unable to compensate for the positioning of the earphones during expansion

Method used

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  • Headphone deformation simulation detection equipment

Examples

Experimental program
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Effect test

Embodiment Construction

[0033] Such as figure 1 and figure 2 As shown, in this embodiment, the present invention includes a frame 1, and the frame 1 is provided with a connecting rod fixing module 2 and two groups of earmuff deformation driving modules 3, and the two groups of earmuff deformation driving modules Group 3 is respectively arranged on both sides of the connecting rod fixing module 2, and the earmuff deformation driving module 3 includes a floating outer pulling module 31, a front and rear deformation module 32, a fixed axis rotation module 33 and an earmuff limiting module connected in sequence. Positioning parts 34, wherein a test data line is set on the fixed-axis rotation module 33 of the earmuff deformation driving module 3, and the floating outer pulling module 31 drives the earmuff limiter 34 to make pitch angle and displacement Adjustment, the front and rear deformation module 32 drives the earmuff limiter 34 to move in a direction perpendicular to the movement of the floating o...

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Abstract

The invention aims to provide the headset deformation simulation detection equipment which is wide in simulation bending test range and capable of performing positioning compensation during earmuff expansion. The device comprises a rack, a connecting rod fixing module and two sets of earmuff deformation driving modules are arranged on the rack, the two sets of earmuff deformation driving modules are arranged on the two sides of the connecting rod fixing module correspondingly, and each earmuff deformation driving module comprises a floating outward pulling module, a front-back deformation module, a fixed-axis rotating module and an earmuff limiting piece which are connected in sequence; a test data line is arranged on the fixed-axis rotating module of one earmuff deformation driving assembly, the floating outward-pulling module drives the earmuff limiting piece to conduct pitch angle and displacement adjustment, and the front-back deformation module drives the earmuff limiting piece to conduct displacement in the direction perpendicular to the movement direction of the floating outward-pulling module. The fixed-axis rotation module drives the earmuff limiting member to perform fixed-axis rotation, and the test data line is connected with the earphone interface. The invention is applied to the technical field of deformation test equipment.

Description

technical field [0001] The invention is applied to the technical field of deformation testing equipment, and in particular relates to a headset deformation simulation testing equipment. Background technique [0002] Headphones, as the name suggests, are worn on the head, not inserted into the ear canal, and are different from in-ear earplugs. It is composed of two parts, a signal transmitter and an earphone with a signal receiving and amplifying device. The transmitter is connected to the signal source, and it can also be connected to a preamp or headphone amplifier in front of the transmitter to improve the sound quality and adjust the timbre. It has the advantages of good sound field, very good sound quality, good comfort, does not enter the ear, avoids scratching the ear canal, and protects the eardrum, etc. [0003] In order to ensure the performance and quality of earphone products, relevant performance tests need to be done before leaving the factory. Headphone testi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R29/00H04R1/10
CPCH04R29/00H04R1/1008H04R2201/10
Inventor 张智力杨海根李汉德廖玉雄毛宁
Owner ZHUHAI BOJAY ELECTRONICS
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