Preparation process of rigid-flex board with laser blind holes

Abstract

The invention discloses a preparation process of a rigid-flex board with laser blind holes. The preparation process comprises the following steps: S1, providing a flexible board serving as an inner layer, a PP board serving as an interlayer and a copper foil serving as an outer layer circuit; S2, stacking the copper foil, the PP board, the soft board, the PP board and the copper foil in sequence to be subjected to pressure transmission lamination; S3, taking an optical point of the inner-layer soft board as a reference point, and burning off pure copper in a laser mode at a position where a blind hole needs to be processed to form a first-stage blind hole; S4, taking an optical point of the inner-layer soft board as a reference point, and burning off PP laser at the position of the first-stage blind hole in a laser mode to form a second-stage blind hole, so as to form a blind hole needing to be processed; and S5, cleaning and checking the blind hole. According to the invention, the manufacturing mode that pure copper at the blind hole position needing laser is burnt out in a laser mode is used for replacing a traditional etching windowing mode that copper is etched away at the blind hole position through etching, and the method has the advantages of being short in technological process, capable of effectively reducing cost, high in laser machining precision and the like.

Description

technical field [0001] The invention relates to the technical field of production of rigid-flex boards, in particular to a preparation process of rigid-flex boards with laser blind holes. Background technique [0002] Rigid-flex board is a circuit board with FPC characteristics and PCB characteristics formed by combining flexible circuit boards and rigid circuit boards through lamination and other processes according to relevant process requirements. Since the rigid-flex board has both the characteristics of FPC and PCB, it can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which is helpful for saving the internal space of the product and reducing the It is of great help to increase the volume of the finished product and improve the performance of the product. [0003] However, due to the various production processes of the rigid-flex board, it also has problems such as high production difficulty, low yield ...

AI Technical Summary

Problems solved by technology

[0003] However, due to the various production processes of the rigid-flex board, it also has problems such as high production difficulty, low yield rate, more materials and manpower, especially the blind hole design of the rigid-flex board is increasing. The precision requirements of the holes are getting higher and higher. Using the traditional etching method on the copper foil to open the window and then process the blind hole, not only the precision is low, but also the process is longer and the production cost is higher.

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