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Radio frequency integrated circuit and method for integrating radio frequency integrated circuit

A radio frequency integrated circuit, integrated technology, applied in circuits, printed circuits, printed circuits, etc., can solve problems such as inability to independently optimize and difficult to design

Active Publication Date: 2022-01-25
REALTEK SEMICON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Single-antenna embodiments are more cost-effective but harder to design since the transmitter and receiver are not separate and cannot be optimized independently

Method used

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  • Radio frequency integrated circuit and method for integrating radio frequency integrated circuit
  • Radio frequency integrated circuit and method for integrating radio frequency integrated circuit
  • Radio frequency integrated circuit and method for integrating radio frequency integrated circuit

Examples

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Embodiment Construction

[0128] The present disclosure is directed to a radio transceiver. While the specification describes a number of embodiments of the present disclosure that are considered to be advantageous modes of carrying out the invention, it should be understood that the invention may be practiced in various ways without being limited or by the specific examples described below. implementation of any feature in a particular example. In other instances, well-known details have not been shown or described to avoid confusion.

[0129] Those skilled in the art understand the microelectronics-related words and basic concepts used in this disclosure, such as "voltage", "current", "signal", "power supply", "ground", "complementary metal oxide semiconductor" (CMOS)", "N-Channel Metal Oxide Semiconductor (NMOS)", "P-Channel Metal Oxide Semiconductor (PMOS)", "Inductor", "Capacitor", "Balun Transformer", "Inverter", "amplifier", "cascode", "cascode", "differential", "single-ended", "logic signal" ...

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PUM

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Abstract

A radio frequency integrated circuit and a method for integrating a radio frequency integrated circuit are provided. A transmitter, a receiver, a first connecting pad, a second connecting pad and a first inductor are integrated on a crystal grain. The transmitter is controlled by a first logic signal and is used for receiving a signal to be transmitted and outputting a first voltage at a first internal node. The receiver is controlled by the first logic signal and a second logic signal and is used for receiving a second voltage from a second internal node and outputting a receiving signal. The first connecting pad is connected to the first internal node, and the second connecting pad is connected to the second internal node. The first inductor is disposed across the first internal node and the second internal node. A first connecting line is used for connecting the first connecting pad to a first pin in a package. A second connecting line is used for connecting the second connecting pad to a second pin in the package. A third connecting line is used for connecting the first connecting pad to the second pin in the package.

Description

technical field [0001] The present disclosure relates to a radio transceiver. Background technique [0002] like Figure 1A As shown, the radio transmitter 100A includes a power amplifier (power amplifier, PA) 131 and a transmitting antenna 111 . The energy amplifier 131 converts the first radio frequency (radio frequency) signal X 1 Amplify to the second radio frequency signal X 2 , and the transmitting antenna 111 transmits the second radio frequency signal X 2 radiate into the air. like Figure 1B As shown, the radio receiver 100B includes a receiving antenna 121 and a low-noise amplifier (LNA) 141 . The receiving antenna 121 extracts the third radio frequency signal X from the air 3 , and the low noise amplifier 141 converts the third radio frequency signal X 3 Amplify to the fourth radio frequency signal X 4 . A radio transceiver includes a radio transmitter and a radio receiver, and can be a dual-antenna embodiment or a single-antenna embodiment. In the dual-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40H04B1/401
CPCH04B1/40H04B1/401H01Q23/00H03F3/195H03F2200/294H03F2200/451H03F2203/45228H03F3/45475H03F2200/541H03F2203/45731H01L23/66H01L2223/6677H01L23/645H01L2223/6655H05K2201/10098H05K1/181H05K1/0243H01Q1/22H03F3/245H01L21/4853H01L2223/6611H01L2223/6627
Inventor 梁宝文林嘉亮
Owner REALTEK SEMICON CORP