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Preparation method of vertically-oriented three-dimensional expanded graphite heat conductor and reinforced heat-conducting polymer-based composite material thereof

A technology of thermally conductive polymer and expanded graphite, applied in heat exchange materials, chemical instruments and methods, etc., can solve problems such as limiting the utilization of nanomaterials

Pending Publication Date: 2022-01-28
EAST CHINA UNIV OF SCI & TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the aggregation phenomenon caused by strong self-interactions limits the further utilization of nanomaterials.

Method used

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  • Preparation method of vertically-oriented three-dimensional expanded graphite heat conductor and reinforced heat-conducting polymer-based composite material thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0077] (1) Preparation of vertically oriented three-dimensional expanded graphite-graphene oxide heat conductor:

[0078] Mix expanded graphite with a diameter of 100 μm and a thickness of 1 μm, graphene oxide with a diameter of 5 μm, and water at a mass ratio of 50:1:100, the ball milling speed is 50 rpm, and the ball milling time is 1 h.

[0079] The expanded graphite-graphene oxide mixed aqueous slurry was subjected to directional freezing treatment, and was frozen at -30°C for 12h. And put the frozen aqueous slurry into a freeze dryer for freeze-drying treatment, the vacuum degree of the freeze-drying treatment is -30Pa, the freezing temperature of the freeze-drying treatment is -52°C, and the time of the freeze-drying treatment is 24h; The density of the obtained vertically oriented three-dimensional expanded graphite-graphene oxide heat conductor is 416 mg / cm 3 . Such as figure 1 As shown, the vertically oriented three-dimensional expanded graphite-graphene oxide heat...

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Abstract

The invention discloses a preparation method of a vertically-oriented three-dimensional expanded graphite heat conductor and a reinforced heat-conducting polymer-based composite material thereof, and relates to a vertically-oriented three-dimensional expanded graphite heat conductor and a preparation method thereof, and application of the vertically-oriented three-dimensional expanded graphite heat conductor to improve the heat conductivity of polymer matrix composite materials. The vertically-oriented three-dimensional expanded graphite heat conductor has a continuous vertically-oriented three-dimensional filler network structure and is composed of flaky expanded graphite and reduced graphene oxide, wherein the reduced graphene oxide serves as a framework material for supporting the expanded graphite to form a three-dimensional structure. The invention provides a polymer-based composite material reinforced by adopting the vertically-oriented three-dimensional expanded graphite heat conductor, wherein the vertically-orientedthree-dimensional expanded graphite heat conductor is used as a continuous phonon transmission skeleton for efficiently improving the heat-conducting property of the polymer-based composite material, the longitudinal heat-conducting property of the heat-conducting polymer-based composite material can reach 10-40W / (m.K).

Description

technical field [0001] The invention belongs to the technical field of preparation of thermally conductive polymer-based composite materials, and relates to a vertically oriented three-dimensionally expanded graphite heat conductor, its preparation method and its use as a filler to enhance the thermal conductivity of a thermally conductive polymer-based composite material, in particular to a vertically oriented three-dimensionally expanded graphite A graphite heat conductor, a preparation method thereof, a polymer-based thermally conductive polymer-based composite material using the thermally conductive body as a high thermally conductive filler, and a preparation method of the thermally conductive polymer-based composite material. Background technique [0002] With the rapid development of the electronics industry towards highly integrated, lightweight, and multifunctional devices, the packaging density of electronic components or units has increased significantly. Heat acc...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K7/24C08K3/04C09K5/14
CPCC08K7/24C08K3/042C09K5/14C08K2201/005C08L83/04
Inventor 刘超吴唯
Owner EAST CHINA UNIV OF SCI & TECH
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