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Wafer cleaning and flaw detection method

A technology for cleaning wafers and rollers, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as failure to find wafer breakage and damage, affecting wafer processing, and wafer damage. , to achieve the effect of improving the effect and quality of wafer cleaning and improving the degree of cleaning automation

Inactive Publication Date: 2022-02-08
JIANGSU ASIA ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When the existing wafer cleaning equipment is in use, it can only simply clean the wafer, and cannot completely remove the stains on the wafer, which affects the subsequent processing of the wafer, and the existing wafer cleaning equipment is cleaning After that, the wafer cannot be inspected. When the cleaning force of the cleaning roller is too high, since the staff cannot find whether there is a slight fracture or damage inside the wafer after cleaning, if the cleaning is continued according to the previous process, it is easy to cause Lots of wafer damage

Method used

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  • Wafer cleaning and flaw detection method
  • Wafer cleaning and flaw detection method
  • Wafer cleaning and flaw detection method

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Embodiment 1

[0038] see Figure 1-Figure 9 , the embodiment of the present invention provides a technical solution: a wafer cleaning equipment with flaw detection function, including a cleaning box 1, the top of the cleaning box 1 is provided with a top cover 2, and the top of the two side walls of the cleaning box 1 and the top cover 2 The bottom of the two side walls are welded with supporting plates 3, and at the same time, the two groups of supporting plates 3 are connected through the electric push rod 4, through the cleaning box 1, the supporting plate 3 and the electric push rod 4 can be installed on the top cover 2, and the electric The push rod 4 can flexibly adjust the distance between the top cover 2 and the cleaning box 1, thereby enabling the equipment to clean wafers of different thicknesses; the cleaning box 1 and the middle of the top cover 2 are installed There is a partition 6, through which the cleaning box 1 and the top cover 2 can be divided into two working compartmen...

Embodiment 2

[0060] This embodiment provides a wafer cleaning flaw detection method, which can use the wafer cleaning equipment with flaw detection function in Embodiment 1, including the following steps:

[0061] S1: Place the wafer to be cleaned on the conveyor belt;

[0062] S2: Make the wafer pass through a conveyor belt with cleaning rollers, the conveyor belt has first conveyor rollers 7 and cleaning rollers 12 arranged at intervals, and the first conveyor rollers 7 and cleaning rollers 12 are arranged in pairs in the height direction , the wafer passes between the first conveying rollers 7 or cleaning rollers 12 arranged in pairs, and a water spray assembly 11 is arranged above and below the cleaning rollers 12 for spraying the two sides of the wafer respectively;

[0063] S3: After the wafer spray cleaning is completed, enter the second conveying roller, and dry the wafer through the drying assembly 25 arranged above and below the second conveying roller;

[0064] S4: Ultrasonic f...

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Abstract

The invention discloses a wafer cleaning and flaw detection method. A first conveying roller and a cleaning roller which are arranged at an interval are used to carry out water spraying cleaning treatment on the upper and lower surfaces of a wafer while conveying the wafer, so that the wafer cleaning effect and quality are improved, and the cleaning automation degree is improved; drying is realized by using a drying assembly; and finally, ultrasonic flaw detection is carried out on the wafer to judge whether the wafer is damaged or not.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning equipment, in particular to a wafer cleaning flaw detection method. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. At present, domestic wafer production lines are mainly 8-inch and 12-inch. [0003] When the existing wafer cleaning equipment is in use, it can only simply clean the wafer, and cannot completely remove the stains on the wafer, which affects the subsequent processing of the wafer, and the existing wafer cleaning equipment is cleaning After that, the wafer cannot be inspected. When the cleaning force of the cleaning roller is to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67H01L21/677B08B3/02G01N29/04
CPCH01L21/67051H01L21/67034H01L21/6776H01L22/10B08B3/022G01N29/04
Inventor 钱诚李刚童建
Owner JIANGSU ASIA ELECTRONICS TECH CO LTD